Module Housing Integrating Leadframe for Contacting and Fixing
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Solution Overview
Problem
Existing module housing technologies require additional costly process steps for contacting components and providing protective housings, often necessitating extra carrier elements and printed circuit boards, which complicates the manufacturing and assembly processes.
Innovation Solution
A module housing design that integrates components into an outer housing through a form-fitting and material connection, eliminating the need for additional carrier elements, using a connecting element with electrical and mechanical functions for both contacting and fixing, and enabling flexible shaping through injection molding, thereby simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional carrier elements and printed circuit boards are used for contacting components, then electrical contacting is achieved, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent combines the functions of mechanical support, electrical contacting, and signal transmission into a single integrated leadframe structure. The leadframe serves simultaneously as the carrier element, the electrical contact element, and the signal transmission path to the printed circuit board, eliminating the need for separate carrier elements and additional contact elements.
Solution Approach 2:
The leadframe is designed to perform multiple functions: it provides mechanical support for the semiconductor component, serves as the electrical contact element for signal transmission, and acts as the structural carrier. This multi-functional design reduces the overall number of components needed in the module housing.
2Reliability
If additional carrier elements and printed circuit boards are used for contacting components, then electrical contacting is achieved, but manufacturing costs increase
Solution Approach 1:
The patent combines the functions of mechanical support, electrical contacting, and signal transmission into a single integrated leadframe structure. The leadframe serves simultaneously as the carrier element, the electrical contact element, and the signal transmission path to the printed circuit board, eliminating the need for separate carrier elements and additional contact elements.
Solution Approach 2:
The leadframe is designed to perform multiple functions: it provides mechanical support for the semiconductor component, serves as the electrical contact element for signal transmission, and acts as the structural carrier. This multi-functional design reduces the overall number of components needed in the module housing.
3Ease of manufacture
If inner housing is locked only from base side by material connection, then assembly is simplified, but mechanical protection and locking function are insufficient
Solution Approach 1:
The housing is divided into two distinct parts: an inner housing that directly contacts and protects the semiconductor component, and an outer housing that provides additional mechanical protection and structural support. This segmentation allows each housing part to perform its specific function optimally while working together as a complete protective system.
Solution Approach 2:
The inner housing is nested within the outer housing, creating a layered protective structure. The inner housing provides first-level protection directly around the component, while the outer housing provides second-level protection and structural support, similar to nested dolls where smaller protective elements are contained within larger ones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for easy implementation of customer-specific shapes and electrical contacting without additional components, reducing processing costs and ensuring maximum protection and locking of the inner housing, while enabling complex electrical circuits and variable plug shapes.
Implementation Method 1
the connecting element 4 is overmoulded with the inner housing material (2) in a first partial area (6) to produce an inner housing (2)
Implementation Method 2
the inner housing (2) is overmoulded with the outer housing material (3) in a second partial area (6') to produce an outer housing (3)
Implementation Method 3
it being possible in particular for the electrical plug contact to be shaped in different ways by means of corresponding stamping and bending processes
Data Source
Figure 1~2a
Figure 2b~2e
Figure 2f~3
AI summary
The invention relates to a module housing comprising an inner housing, an outer housing and a connecting element, the inner housing comprising at least one component and being completely enclosed by the outer housing in a form-fit manner and the connecting element being enclosed in a form-fit manner in a first partial region of the inner housing, characterized in that the connecting element comprises electrical plug contacts in a third partial region.