Power Semiconductor Module Housing Assembly Without Gluing
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Solution Overview
Problem
The assembly of power semiconductor module arrangements is inefficient and costly due to the need for additional pretreatment and hardening steps when gluing the housing to the substrate, which increases process time and overall costs.
Innovation Solution
A power semiconductor module arrangement that uses holding pins mechanically connected to the substrate and holding elements integrated with the housing, forming a force-fitting connection to secure the housing in place without the need for gluing, thereby simplifying the assembly process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gluing is used to attach the housing to the substrate, then the housing remains in the desired position, but additional pretreatment steps, glue application, and hardening steps are required, increasing process time and costs
Solution Approach 1:
The patent extracts the housing attachment function from the chemical gluing process and implements it through a purely mechanical connection system using holding pins and holding elements. This eliminates the need for pretreatment, glue application, and hardening steps, reducing assembly time while maintaining reliable housing position stability through the mechanical force-fitting connection.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (gluing) with a mechanical connection system consisting of holding pins inserted into holding elements. This mechanical substitution eliminates the need for chemical pretreatment and hardening processes, significantly reducing assembly process time while ensuring reliable housing attachment through mechanical interference fit.
2Reliability
If gluing is used to attach the housing to the substrate, then the housing remains in the desired position, but additional process steps are required, increasing overall costs
Solution Approach 1:
The patent removes the chemical gluing process from the manufacturing sequence and replaces it with a simple mechanical insertion process. This extraction of the chemical bonding step eliminates associated costs for pretreatment, glue materials, and hardening equipment, reducing overall manufacturing costs while maintaining housing position stability through the mechanical holding pin system.
Solution Approach 2:
The patent employs simple, inexpensive holding pins and holding elements that can be easily manufactured and replaced if necessary. These mechanical components are simpler and cheaper than the chemical gluing system, eliminating costs associated with specialized adhesives, pretreatment chemicals, and hardening equipment, thereby reducing overall assembly costs while ensuring reliable housing attachment.
3Reliability
If multiple assembly steps are used to attach the housing, then reliable attachment is achieved, but the assembly process becomes more complex
Solution Approach 1:
The patent extracts the essential attachment function from the complex multi-step gluing process and implements it through a single mechanical insertion step using holding pins and holding elements. This simplifies the assembly process by eliminating pretreatment, glue application, and hardening steps, reducing process complexity while maintaining reliable housing attachment through the mechanical force-fitting connection.
Solution Approach 2:
The patent replaces the complex chemical bonding system (requiring pretreatment, glue application, and hardening) with a simple mechanical connection system. This substitution reduces assembly process complexity from multiple chemical steps to a single mechanical insertion operation, while ensuring reliable housing attachment through the mechanical interference fit of the holding pins in the holding elements.
Data Source
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AI summary
A power semiconductor module arrangement comprises a housing, a substrate forming a ground surface of the housing, one or more holding pins mechanically connected to the substrate, and one or more holding elements attached to or integrally formed with the housing, wherein a first end of each of the one or more holding pins is arranged inside the housing and connected to the substrate, each of the one or more holding elements comprises a sleeve configured to receive a free end of one of the holding pins, and each of the one or more holding pins extends from the substrate in a vertical direction perpendicular to a top surface of the substrate towards a different one of the one or more holding elements such that the free end of each of the one or more holding pins is arranged inside the respective holding element in order to form a force-fitting connection.