Power Semiconductor Module Housing Retention Without Gluing
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Solution Overview
Problem
The assembly of power semiconductor modules is inefficient and costly due to the need for additional pretreatment and hardening steps required for gluing the housing to the substrate, which increases process time and overall costs.
Innovation Solution
A power semiconductor module arrangement with terminal elements that protrude through holes in the housing, where a holding element between the terminal elements' ends exerts a force to secure the housing in place, eliminating the need for additional gluing steps by mechanically holding the housing to the substrate during assembly and shipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the housing is glued to the substrate, then the housing is securely attached, but additional pretreatment steps, glue application, and hardening steps are required, increasing process time and costs
Solution Approach 1:
The patent extracts the attachment function from the gluing process and transfers it to the terminal elements themselves. The terminal elements are designed with holding elements that mechanically engage with the housing, allowing the housing to be secured without requiring glue application or hardening steps. This separates the electrical connection function from the mechanical attachment function, resolving the contradiction between secure attachment and process time.
Solution Approach 2:
The patent replaces the chemical bonding system (glue) with a mechanical fastening system (holding elements on terminal elements). The holding elements exert mechanical force on the housing to hold it in the desired position, eliminating the need for pretreatment, glue application, and hardening steps. This substitution resolves the contradiction by maintaining attachment strength while dramatically reducing process time.
2Stability of the object's composition
If the housing is glued to the substrate, then the housing remains in position during assembly, but additional process steps and costs are incurred
Solution Approach 1:
The patent extracts the positioning function from the gluing process and integrates it into the terminal elements. The holding elements on the terminal elements provide mechanical retention of the housing in the desired position, eliminating the need for separate pretreatment and glue application steps. This reduces manufacturing complexity while maintaining position stability.
Solution Approach 2:
The terminal elements serve dual functions: providing electrical connection and providing mechanical retention of the housing. The holding elements on the terminal elements automatically hold the housing in position during assembly and shipping without requiring additional processes. This self-service approach resolves the contradiction by simplifying manufacturing while maintaining stability.
3Reliability
If terminal elements protrude through the housing, then electrical connection is achieved, but the housing needs additional attachment methods to remain in position
Solution Approach 1:
The patent merges the electrical connection function and the mechanical attachment function into a single integrated system. The terminal elements with holding elements simultaneously provide electrical connection and secure the housing in position. This combination resolves the contradiction by eliminating the need for separate attachment methods, thereby reducing device complexity while maintaining electrical connection reliability.
Solution Approach 2:
The terminal elements are designed to perform multiple functions: providing electrical connection and providing mechanical retention of the housing. The holding elements on the terminal elements enable the same components to serve both electrical and mechanical purposes. This multi-functionality resolves the contradiction by reducing the number of separate systems needed, thereby simplifying the overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the assembly process, reduces costs, and ensures the housing remains securely positioned until attached to a base plate or heat sink, enhancing the efficiency and cost-effectiveness of power semiconductor module assembly.
Implementation Method 1
each of the plurality of holding elements exerts a force on the housing, thereby holding the housing in a desired position with regard to the substrate
Data Source
Figure 1~2C
Figure 3~5
Figure 6~8
AI summary
A power semiconductor module arrangement comprises a housing comprising a plurality of through holes, a substrate forming a ground surface of the housing, and a plurality of terminal elements mechanically and electrically connected to the substrate, wherein a first end of each of the plurality of terminal elements is arranged inside the housing and connected to the substrate, each of the plurality of terminal elements extends from the substrate in a vertical direction perpendicular to a top surface of the substrate through one of the plurality of through holes to the outside of the housing such that a second end of each of the plurality of terminal elements is arranged outside of the housing, each of the plurality of terminal elements comprises a holding element arranged between the first end and the second end, and each of the plurality of holding elements exerts a force on the housing, thereby holding the housing in a desired position with regard to the substrate.