Semiconductor Module Housing Frame for Glue-Free Substrate Clamping

Solution Overview

Problem

The existing assembly process for power semiconductor modules requires additional pretreatment steps and hardening processes for gluing the housing to the substrate, increasing process time and cost.

Innovation Solution

The housing is assembled by surrounding and clamping the substrate from all sides, using a closed frame formed by two separate housing members that exert pressure and include a holding mechanism to secure the substrate in place, eliminating the need for gluing and reducing assembly time and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the housing is glued to the substrate, then the housing is permanently attached to the substrate, but additional pretreatment steps, glue application steps, and hardening steps are required, increasing process time and cost

Engineering Contradiction:

Improveattachment strengthVSAvoidassembly time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The patent extracts and eliminates the gluing process entirely from the assembly sequence. Instead of using adhesive bonding with pretreatment and hardening steps, the housing is directly clamped onto the substrate using a clamping mechanism that applies mechanical pressure to secure the housing in place, thereby removing multiple process steps and reducing assembly time while maintaining secure attachment

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding system (glue application and hardening) with a mechanical clamping system. The clamping mechanism uses mechanical force to press the housing against the substrate, creating a secure attachment through physical pressure rather than chemical adhesion, thus eliminating the need for pretreatment and hardening steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If the housing is glued to the substrate, then the housing is permanently attached to the substrate, but additional pretreatment steps, glue application steps, and hardening steps are required, increasing overall cost

Engineering Contradiction:

Improveattachment strengthVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent extracts and eliminates the gluing process entirely from the assembly sequence. Instead of using adhesive bonding with pretreatment and hardening steps, the housing is directly clamped onto the substrate using a clamping mechanism that applies mechanical pressure to secure the housing in place, thereby removing multiple process steps and reducing assembly time while maintaining secure attachment

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding system (glue application and hardening) with a mechanical clamping system. The clamping mechanism uses mechanical force to press the housing against the substrate, creating a secure attachment through physical pressure rather than chemical adhesion, thus eliminating the need for pretreatment and hardening steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentEP4513531B1Housing, semiconductor module comprising a housing, and method for assembling a semiconductor module

Publication Date: 2025.10.01 INFINEON TECHNOLOGIES AG

Figure 1~2
Figure 3~5B
Figure 6A~7

AI summary

A housing for a semiconductor module comprises a first housing member and a second housing member, wherein in an unmounted state of the housing, the first housing member and the second housing member are separate and distinct from each other, in an assembled state of the housing, the first housing member and the second housing member are attached to each other and together form a closed frame, and the closed frame formed by the first housing member and the second housing member comprises a mounting section for mounting the housing to a substrate such that the closed frame extends around the substrate.