Electronic Module Housing Layout for Higher Terminal Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Device housing packages face challenges in accommodating an increasing number of electronic components while maintaining a compact size and reduced height, requiring innovative designs to efficiently integrate more electrode terminals.
Innovation Solution
The electronic component housing package incorporates a base and frame with strategically positioned wiring conductors, including projecting portions and conductors on the same plane, allowing for a higher density of wiring without increasing height, made from materials like metal and ceramic, and featuring a connector system for flexible connection to external circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of electrode terminals is increased to accommodate more electronic components, then the terminal count is improved, but the package size and height increase
Solution Approach 1:
The patent transitions from traditional vertical stacking to a planar arrangement where wiring conductors are positioned on the same plane as the frame's side surface. This dimensional reorganization allows multiple conductors to be arranged side-by-side rather than stacked, increasing terminal count without proportionally increasing package volume.
Solution Approach 2:
The wiring conductors are nested within the frame structure, with conductors positioned on the side surface of the frame rather than extending outward. This nesting approach integrates the wiring into the existing frame geometry, adding terminal functionality without increasing the overall package envelope.
2Quantity of substance
If wiring conductors are added to increase terminal count, then the connectivity is improved, but the signal loss increases
Solution Approach 1:
The frame serves as an intermediary structure that provides a common reference plane and mechanical support for all wiring conductors. By positioning all conductors on the same plane of the frame, the patent creates uniform electrical characteristics and controlled impedance paths, reducing signal loss through consistent signal transmission conditions.
3Volume of moving object
If the package size is reduced to maintain compactness, then the compactness is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent applies different material properties to different parts of the package: the frame is made of ceramic material with high thermal conductivity for heat dissipation, while the wiring conductors use materials optimized for electrical conductivity. This local differentiation allows compact packaging while maintaining effective heat transfer pathways through the ceramic frame structure.
Data Source
AI summary
To provide an electronic component housing package and an electronic module enabling an increase in electrode terminals. An electronic component housing package includes a base, a frame, and a wiring conductor. The base includes a first region. The frame is positioned on the base and surrounds the first region. The frame includes a first frame side surface. The wiring conductor is positioned on a surface of the frame. The frame includes a first projecting portion projecting outward from the first frame side surface in a first direction. The wiring conductor includes a first conductor and a second conductor. The second conductor is spaced outward from the first conductor in the first direction. The first conductor and the second conductor are positioned on the first projecting portion and on a same plane.