Module IC Package Structure with Integrated Metal Shielding Layer
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Solution Overview
Problem
Current methods for producing shielding structures in wireless communication systems are costly and time-consuming, often requiring manual labor and specific molds for metal casings, which increases manufacturing expenses and time.
Innovation Solution
A module IC package structure with electrical shielding function is developed, comprising a substrate unit with a grounding layer and inner conductive structure, an electronic unit with components connected to the grounding layer, a package unit with a gel body enclosing the components, and a metal shielding layer contacting the inner conductive layer's exposed end, which is connected to the grounding layer for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate metal shielding structures are produced using traditional methods (sheet steel casing or metal casting), then electrical shielding function is achieved, but manufacturing costs and time expenditure increase disproportionately
Solution Approach 1:
The patent combines the shielding structure with the circuit board by integrating metal layers directly into the PCB manufacturing process. The metal layers are formed on the PCB substrate and connected to grounding layers, creating a unified structure that provides both circuit functionality and electromagnetic shielding without requiring separate shielding components.
Solution Approach 2:
The circuit board is designed to serve multiple functions: it acts as both the circuit carrier and the shielding structure. The metal layers within the PCB perform dual roles of electrical conduction and electromagnetic radiation shielding, eliminating the need for dedicated shielding components and reducing overall device complexity.
2Reliability
If separate metal shielding structures are produced using traditional methods, then electrical shielding function is achieved, but manufacturing time increases due to manual assembly
Solution Approach 1:
The shielding structure is merged with the circuit board manufacturing process itself. The metal layers are formed, patterned, and connected to grounding layers during the same PCB fabrication steps, eliminating subsequent manual assembly operations and reducing total manufacturing time.
Solution Approach 2:
The shielding metal layers are prepared in advance during the PCB manufacturing process, before the final assembly stage. The grounding connections and shielding structures are pre-established within the PCB layers, so that when the PCB is assembled into the device, the shielding function is already integrated and operational.
3Reliability
If complex shielding structures are manufactured using traditional methods, then shielding effectiveness is achieved, but device dimensions and weight increase
Solution Approach 1:
The shielding metal layers are nested within the multi-layer PCB structure itself. The metal layers are embedded between circuit board layers and connected to grounding planes, creating a compact shielding solution that utilizes the existing PCB volume without adding external shielding enclosures or housings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and time by integrating electrical shielding directly into the module IC package structure, eliminating the need for separate shielding structures and manual assembly, while maintaining low weight, small dimensions, and high reliability.
Implementation Method 1
Another important function of wireless communication systems is the electric shielding of radiation emitted by their components in order to minimize interference of this radiation with other electronic devices or components
Implementation Method 2
an inner conductive structure disposed inside the circuit substrate and electrically connected to the grounding layer, wherein the inner conductive structure includes a plurality of inner conductive layers, and each inner conductive layer has a first end directly contacting the grounding layer and a second end opposite to the first end and exposed from the outer surrounding peripheral surface of the circuit substrate
Data Source
AI summary
A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate and a grounding layer disposed inside the circuit substrate. The grounding layer is exposed from the outer surrounding peripheral surface of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The electronic components are electrically connected to the grounding layer through the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate. The metal shielding layer directly contacts the grounding layer, thus the electronic components are electrically connected to the metal shielding layer through the grounding layer.