Resin-Covered Module Layout for Low-Height Eddy Current Shielding
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Solution Overview
Problem
Existing modules suffer from increased height due to the occurrence of eddy currents in conductive films, which degrade shielding performance, and the use of tall bonding wires prevents height reduction.
Innovation Solution
A module design featuring a substrate with components covered by a resin film and wires extending over the film, connected to ground electrodes, forming a compartment shield that reduces eddy currents and maintains shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive film is formed to cover components and resin film, then shielding performance is improved, but eddy currents occur in the conductive film when components are operated, degrading shielding performance
Solution Approach 1:
The conductive film is divided into multiple separate conductive patterns instead of forming a continuous film. These discrete conductive patterns are distributed across the resin film and connect to ground electrodes through vias, breaking the continuous conductive path that would otherwise generate eddy currents while maintaining shielding effectiveness through the distributed pattern structure.
2Reliability
If bonding wires are arranged to extend over components to avoid contact, then electrical short circuits are prevented, but the height of the module increases
Solution Approach 1:
The wire routing is reconfigured to extend in the horizontal plane rather than vertically. Wires are routed along the surface of the resin film and substrate, utilizing the two-dimensional plane to achieve electrical connections without increasing the vertical height of the module. This dimensional shift allows wires to bypass components horizontally while maintaining insulation.
3Reliability
If components are operated with conductive film in close proximity, then shielding is effective, but eddy currents are generated that degrade the shielding performance
Solution Approach 1:
The continuous conductive film is segmented into multiple discrete conductive patterns that are distributed across the resin film. Each pattern is electrically connected to ground electrodes through via holes, creating a distributed shielding structure that prevents eddy current generation while maintaining electromagnetic shielding effectiveness through the collective arrangement of multiple patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a reduced module height while preserving shielding performance by minimizing eddy currents and electrical short circuits, enhancing compartment shielding.
Implementation Method 1
a resin film covering the first component along a shape of the first component and also covering a part of the first surface
Implementation Method 2
one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate
Data Source
AI summary
A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.