Spring-Biased Module Mounting for Cooling and Easy Release
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Solution Overview
Problem
Conventional solutions for mounting and demounting electrical components in telecommunications and similar fields are complicated and inflexible, lacking efficient cooling mechanisms for heat sources.
Innovation Solution
A device that securely positions two modules between mounts, allowing for flexible and efficient mounting and demounting, while effectively transferring heat from the modules to the mounts for improved cooling, using a release apparatus and biasing elements like compression springs and core guides to facilitate easy attachment and detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional mounting solutions are used, then electrical components can be mounted to units, but the attachment and detachment processes are complicated and inflexible
Solution Approach 1:
The device is divided into separable modules (first module, second module, core unit) that can be independently mounted and demounted. The mounting mechanism itself is segmented into a mounting mechanism and a release apparatus, allowing simple attachment operations while maintaining flexibility for maintenance and replacement.
Solution Approach 2:
A core unit acts as an intermediary element between the first and second modules, facilitating their connection and providing a centralized point for the release apparatus to operate. This intermediary structure simplifies the overall mounting mechanism while enabling flexible attachment and detachment of the modules.
2Temperature
If modules are securely mounted between mounts, then stable positioning is achieved, but heat dissipation from the modules is insufficient
Solution Approach 1:
The mounting function and cooling function are merged into a single integrated device. The first and second modules are mounted between the first and second mounts respectively, creating direct thermal contact pathways. This merging allows the mounting structure to simultaneously provide mechanical stability and thermal management, eliminating the need for separate cooling mechanisms.
Solution Approach 2:
The mounting mechanism serves multiple functions: it provides stable mechanical positioning of the modules while simultaneously establishing thermal contact for heat dissipation. The first mount and second mount act as both structural supports and heat sinks, making the mounting system universal for both mechanical and thermal management purposes.
3Ease of operation
If release apparatus moves modules toward each other, then detachment is facilitated, but the distance between contact surfaces becomes less than distance between mounts
Solution Approach 1:
The release apparatus enables dynamic movement of the first and second modules relative to each other and to the mounts. During detachment, the modules can be moved toward each other to reduce the distance between contact surfaces, allowing the release apparatus to effectively disengage the mounting mechanism. This dynamic adjustment facilitates easy detachment while the mounting structure itself maintains the required manufacturing precision when in the mounted state.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uncomplicated and flexible attachment and detachment of modules, along with efficient heat transfer and cooling, improving the reliability and efficiency of module mounting and cooling in telecommunications and similar applications.
Implementation Method 1
a biasing apparatus for urging the first module and the second module away from each other, thereby urging the first module against the first mount and urging the second module against the second mount
Implementation Method 2
the device also provides an efficient transfer of heat generated by the first module and/or second module from the first module and/or second module to the first mount and/or second mount, whereby the first module and/or second module and/is can be efficiently cooled
Data Source
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AI summary
The invention relates to a device (2; 102) for securing a first module (4; 104) and a second module (6; 106) in a space (7; 107) between a first mount (8; 108) and a second mount (10; 110). The device (2; 102) comprises a biasing apparatus (12; 112). The biasing apparatus (12; 112) is configured to urge the first module (4; 104) and the second module (6; 106) away from each other, thereby urging the first module (4; 104) against the first mount (8; 108) and urging the second module (6; 106) against the second mount (10; 110). Further, the device (2; 102) comprises a release apparatus (14; 114). The release apparatus (14; 114) is configured to move the first module (4; 104) and the second module (6; 106) toward each other, thereby moving the first module (4; 104) away from the first mount (8; 108) and moving the second module (6; 106) away from the second mount (10; 110). The device (2; 102) provides an uncomplicated and flexible mounting and demounting of the first and second modules (4, 6; 104, 106), i.e. a flexible and uncomplicated attachment of each module (4, 6; 104, 106) to the respective mount (8, 10; 108, 110) and a flexible and uncomplicated detachment of each module (4, 6; 104, 106) from the respective mount (8, 10; 108, 110) are attained. The invention also relates to an arrangement (142) which comprises the device (2; 102) and may be part of a network access node for a wireless communication system.