Electronic Module Package Member Positioning

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Solution Overview

Problem

Existing electronic module installation methods in image capturing and display apparatuses lack the necessary accuracy, leading to potential foreign object generation and assembly challenges due to inadequate positioning and support structures.

Innovation Solution

A method involving a package member with inner convex portions for precise positioning and support of electronic devices, where the first side surface of the substrate is brought into contact with these convex portions, and an adhesive is used to fix the device, ensuring accurate alignment and attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional bonding methods are used to join substrates and mount electronic devices, then the manufacturing process is simple, but the installation accuracy of electronic modules deteriorates

Engineering Contradiction:

Improveinstallation accuracyVSAvoidpackage member structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The package member is segmented into multiple functional portions: a base with an opening, a holding frame with side walls, and inner convex portions positioned within the opening. This segmentation allows each component to perform its specific function - the holding frame provides structural support while the inner convex portions enable precise positioning of the electronic device, thereby improving installation accuracy without requiring a completely new design approach

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The inner convex portions act as intermediary elements between the electronic device and the holding frame. These convex portions engage with corresponding recesses or surfaces on the electronic device to provide precise positioning and alignment, serving as a mediator that translates the structural support of the holding frame into accurate installation positioning

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the electronic device is positioned without precise support structures, then the manufacturing process is simple, but foreign objects may be generated due to scraping

Engineering Contradiction:

Improveforeign object generationVSAvoidassembly process

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The holding frame with side walls and inner convex portions is designed beforehand to provide controlled support surfaces. These pre-configured structures prevent direct contact and scraping between the electronic device and the holding frame during assembly, thereby preventing foreign object generation before the problem can occur. The cushioning effect is achieved through the geometric design of the convex portions that guide proper positioning

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Manufacturing precision

If inadequate positioning structures are used, then the device complexity is low, but the electronic module cannot be installed with high accuracy respect to the housing

Engineering Contradiction:

Improvepositioning accuracyVSAvoidpackage member structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The inner convex portions are asymmetrically positioned within the opening of the base, with specific convex portions located at different positions to correspond to different sides of the electronic device. This asymmetric arrangement provides directional positioning cues that ensure the electronic device is installed with high accuracy respect to the housing, while keeping the overall structure relatively simple

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the installation accuracy of electronic modules, reduces the risk of foreign object generation, and improves heat dissipation while minimizing component complexity and cost.

Implementation Method 1

an adhesive is used to fix the device

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS11448914B2Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device

Publication Date: 2022.09.20 CANON KK

AI summary

A method of manufacturing an electronic module that comprises preparing an electronic device in which a first substrate and a second substrate have been joined and coupling the electronic device to a package member. The first substrate includes a front surface, a back surface on an opposite side of the front surface, and a first side surface between an edge portion of the front surface and an edge portion of the back surface. The package member includes a first portion that includes an opening and a second portion that is arranged at a position which does not overlap the opening. The coupling includes bringing the first side surface into contact with the second portion in a state in which the second substrate is positioned between the first portion and the first substrate, and fixing the package member and the electronic device.