Module Package Encapsulation with Protective Cavity
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Solution Overview
Problem
Current production methods require separate process chains for SAW filters and module production, leading to inefficiencies and the need for additional housing for sensitive component structures.
Innovation Solution
A module package with an encapsulation layer that partly underfills the chip, using a filler with low gap penetration to create a protective cavity for component structures, eliminating the need for additional housing and allowing for denser integration of chips and components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the encapsulation layer completely fills the gap between chip and module carrier, then manufacturing simplicity is improved, but sensitive component structures are exposed to harmful factors
Solution Approach 1:
The encapsulation layer is designed with spatially varying properties: it fills the gap in regions without sensitive components while leaving cavities in regions with sensitive components. This local differentiation allows the same material to simultaneously provide protection where needed and preserve functionality where sensitive structures exist, resolving the contradiction between manufacturing simplicity and component protection.
Solution Approach 2:
The gap filling process is segmented into different regions: filled regions and cavity regions. The encapsulation layer is applied selectively to create discrete cavities that accommodate sensitive component structures while filling other areas, thus achieving both protection and manufacturing efficiency without requiring separate housing for sensitive components.
2Manufacturing precision
If separate process chains are used for SAW filter and module production, then manufacturing precision is maintained, but productivity decreases
Solution Approach 1:
The patent merges the previously separate SAW filter production and module production process chains into a single integrated process. SAW filters are manufactured directly on the module carrier substrate, eliminating the need for separate production lines, intermediate handling, and assembly steps. This consolidation maintains manufacturing precision through controlled processes while significantly improving productivity by reducing process steps and cycle time.
Solution Approach 2:
The module carrier substrate serves multiple functions: it acts as both the production substrate for SAW filters and the final module substrate. The same substrate undergoes both filter fabrication processes and module assembly processes, eliminating the need for separate substrates and reducing overall manufacturing complexity while maintaining quality standards.
3Object-affected harmful factors
If additional housing is provided for sensitive component structures, then protection is improved, but device complexity increases
Solution Approach 1:
The encapsulation layer serves dual functions: it acts as both the protective housing for sensitive component structures and the standard encapsulation for the entire module. By merging these two previously separate functions into a single structure, the patent eliminates the need for additional housing components while maintaining protection of sensitive elements, thus reducing device complexity without compromising protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach unifies the process chains for SAW filter and module production, reducing processing steps, increasing integration density, and minimizing module height while protecting sensitive components.
Implementation Method 1
a filler is admixed with the encapsulation layer and the encapsulation layer is configured in such a way that it partly underfills the chip
Data Source
AI summary
The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8, and to a method for producing same. The chip 2, 3 has component structures on the top side 13, 14 thereof. Said top said 13, 14 faces the module carrier 1, wherein a gap 4, 5 is formed between the top side 13, 14 of the chip and the module carrier 1. A filler is added to the encapsulation layer 8. The encapsulation layer 8 partly fills underneath the chip 2, 3, wherein at most the part of the chip 2, 3, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layer 8 completely encloses the sides of the chip 2, 3.