Power Semiconductor Module Pin Offset Encoding for Accurate Mounting
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Solution Overview
Problem
Accurate alignment of power semiconductor module pins with circuit board openings is challenging due to complex optical scanning processes and labor-intensive manual fitting, leading to potential pin and board damage.
Innovation Solution
Encoding a positional offset on the power semiconductor module's surface, which is deciphered to adjust the pressing position of automated equipment, ensuring precise alignment of pins with circuit board openings without optical scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical scanning is used to detect pin tip positions, then alignment accuracy can be achieved, but the process becomes complex and slow
Solution Approach 1:
The patent extracts the alignment information from the complex optical scanning process by encoding positional offset data directly on the module housing. This eliminates the need for complex optical detection equipment during mounting, as the pressing device can simply read the encoded offset values to achieve accurate pin alignment.
Solution Approach 2:
The positional offset information is determined and encoded on the module housing before the mounting process. This preliminary encoding of alignment data allows the pressing device to directly use this information without performing complex real-time optical scanning, thereby simplifying the mounting process while maintaining alignment accuracy.
2Measurement precision
If manual press fitting is used to align pins, then alignment can be achieved, but the process becomes labor intensive and slow
Solution Approach 1:
The module housing provides its own alignment information through the encoded positional offset data. This self-contained alignment information allows automated pressing devices to quickly and accurately position pins without requiring manual intervention or complex real-time detection, thereby improving both accuracy and productivity.
3Difficulty of detecting and measuring
If complex optical detection is implemented, then pin tip recognition can be achieved, but dedicated equipment and know-how are required
Solution Approach 1:
The patent extracts the essential alignment information from the complex optical detection process and encodes it in a simple machine-readable format on the module housing. This eliminates the need for dedicated optical inspection equipment and specialized know-how, as any standard reading device can decode the positional offset information.
4Measurement precision
If manual alignment methods are used, then pin positioning can be achieved, but labor intensity increases
Solution Approach 1:
The module housing provides its own alignment guidance through encoded positional offset data. This eliminates the need for manual alignment operations, as the automated pressing device can directly read the encoded information and position the pins accurately, thereby reducing labor intensity while maintaining ease of operation.
Data Source
AI summary
A method of increasing overall pin alignment accuracy for a power semiconductor module is provided. The power semiconductor module has a plurality of pins protruding from a housing of the power semiconductor module. The method includes: determining a positional deviation of each pin of the plurality of pins from a respective target position in a coordinate system; determining a positional offset for the power semiconductor module based on the positional deviations of the pins, the positional offset reducing overall misalignment between the plurality of pins and the target positions; and encoding the positional offset on an exposed surface of the power semiconductor module. Methods of mounting the power semiconductor module to a circuit board and/or heat sink are also provided.