Semiconductor Module Power Circuit Layout for Fewer PCB Layers
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Solution Overview
Problem
As the integration density of semiconductor modules increases, requiring more types of electric power, the number of wiring layers in the main substrate also increases, leading to higher costs.
Innovation Solution
A semiconductor device with a main substrate and a semiconductor module, where the semiconductor module has a second power supply circuit mounted on its module substrate, generating the electric power needed for its components, thereby reducing the need for power transmission from the main substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more types of electric power are supplied to the semiconductor module to support increased integration density, then the functionality and performance of the semiconductor module is improved, but the number of wiring layers in the main substrate increases and cost increases
Solution Approach 1:
The power supply system is segmented into two independent parts: a first power supply circuit on the main substrate and a second power supply circuit on the module substrate. This segmentation allows each substrate to have its own dedicated power supply, eliminating the need for complex cross-substrate power transmission wiring and reducing the number of wiring layers required on the main substrate.
Solution Approach 2:
The power supply architecture transitions from a single-plane configuration to a two-dimensional distributed configuration. By placing power supply circuits on both the main substrate and the module substrate, the system utilizes the vertical dimension (different substrate layers) to distribute power, thereby reducing the wiring complexity on any single substrate plane.
2Reliability
If power is transmitted from the main substrate to the semiconductor module, then the semiconductor module receives necessary electric power, but wiring for electric power transmission occupies significant wiring resources and increases cost
Solution Approach 1:
The module substrate is equipped with a second power supply circuit that generates power locally for elements on the module substrate. This self-service approach eliminates the need for the main substrate to transmit power to the module substrate, as each substrate independently supplies power to its own elements, thereby simplifying the wiring structure.
3Reliability
If wiring width is increased to maintain low impedance for high current consumption, then power transmission reliability is improved, but the number of wiring layers increases and cost increases
Solution Approach 1:
The power transmission path is segmented into two separate, independent paths: one on the main substrate for the first power supply circuit, and another on the module substrate for the second power supply circuit. This segmentation allows each substrate to optimize its own power wiring without being constrained by the need to provide thick power transmission wiring across substrate boundaries, thereby reducing the total number of wiring layers required.
Data Source
AI summary
The present invention supplies electric power to a semiconductor module appropriately and also curbs the number of wiring layers of a main substrate on which the semiconductor module is mounted. A semiconductor device (10) is provided with a main substrate (90) and a semiconductor module (1). A first power supply circuit (71), the semiconductor module (1), and a first element (9) are mounted on the main substrate (90). The semiconductor module (1) is provided with a second element (2, 3) and a module substrate (4) on which the second element (2, 3) is mounted. The first power supply circuit (71) supplies electric power (Vcc) to the first element (9). The semiconductor module (1) is further provided with a second power supply circuit (72) mounted on the module substrate (4), and the second power supply circuit (72) supplies electric power (Vcc) to the second element (2, 3).