Module With Protruding Metal Shielding For Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing high frequency modules face challenges in improving shielding properties without compromising the distance between surface mount elements and metal walls to prevent short circuits, limiting the effectiveness of noise reduction.
Innovation Solution
A module design featuring a substrate with a metal member having a plate-shaped portion and an upper protruding portion, where the electronic components are positioned in front of and behind the metal member, and a sealing resin layer covers them, enhancing shielding without the need for close proximity to the metal member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the surface mount element is disposed close to the metal wall to improve shielding property, then the shielding effectiveness is enhanced, but the risk of short circuit between the surface mount element and the metal wall increases
Solution Approach 1:
The invention transitions from a conventional planar metal wall structure to a three-dimensional structure with an upper protruding portion that extends vertically upward. This dimensional change allows the shielding effect to reach closer to the surface mount element without requiring the element to be positioned closer to the base metal wall, thus improving shielding while maintaining safe spacing to prevent short circuits.
Solution Approach 2:
The metal wall is segmented into two distinct parts: a base metal wall portion and an upper protruding portion. The upper protruding portion is specifically designed to extend upward with a thickness thinner than the base metal wall, creating a graduated shielding structure that provides enhanced electromagnetic shielding near the surface mount element while maintaining adequate clearance to avoid short circuit risks.
2Object-affected harmful factors
If the distance between the surface mounting element and the metal wall is reduced to improve shielding, then noise reduction is enhanced, but the manufacturing precision requirements increase to prevent short circuit
Solution Approach 1:
By extending the metal wall structure vertically upward through the upper protruding portion, the invention provides shielding in the vertical dimension rather than relying solely on horizontal proximity. This allows effective noise reduction to be achieved through the upward extension of the protruding portion rather than by reducing the horizontal distance between the surface mount element and the metal wall base, thereby avoiding increased manufacturing precision requirements.
3Ease of manufacture
If the metal member structure is simplified to reduce device complexity, then manufacturing ease is improved, but the shielding property deteriorates
Solution Approach 1:
The metal member is divided into two functional segments: a substantial base metal wall portion that provides structural support and grounding, and an upper protruding portion that specifically addresses shielding requirements. This segmentation allows each part to be optimized independently - the base portion for structural integrity and ease of manufacture, and the protruding portion for enhanced shielding performance.
Solution Approach 2:
The upper protruding portion is designed with localized characteristics (thinner thickness, upward extension) specifically where shielding is most needed near the surface mount element, while the base metal wall maintains greater thickness for structural purposes. This local differentiation of properties achieves enhanced shielding without unnecessarily complicating the entire metal member structure.
Data Source
AI summary
A module includes: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate, the metal member having a plate-shaped portion including a front main surface and a back main surface arranged in a front-back direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member. The metal member includes an upper protruding portion extending on one side of the front-back direction from an upper end of the plate-shaped portion.