Electronic Module Thermal Dissipation via Segmented Terminals
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Solution Overview
Problem
In electronic modules with components of different heights, thermally conductive bumps result in varying heat dissipation paths, leading to inconsistent heat dissipation among components.
Innovation Solution
A module design featuring a wiring board with components of different heights, where a sealing resin covers the components while exposing their surfaces, and taller connection terminals ensure equal and efficient heat dissipation by allowing direct heat release without hindrance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thermally conductive bumps are used to connect electronic components of different heights to the heat sink plate, then the components can be mounted at different heights, but the heat dissipation becomes inconsistent due to different heat dissipation path lengths
Solution Approach 1:
The connection structure is segmented into two parts: a standard-height thermally conductive bump for thermal conduction and an extended connection terminal for electrical connection. This segmentation allows the thermal conduction path to remain uniform while accommodating components of different heights through the extended terminal portion.
Solution Approach 2:
The connection terminal acts as an intermediary element between the electronic component and the wiring board. It provides both electrical connection and mechanical support, allowing the component to be mounted at appropriate height while maintaining consistent thermal contact through the bump portion.
2Adaptability or versatility
If tall connection terminals are used to accommodate high components, then components of different heights can be connected, but the heat dissipation path becomes longer and less efficient
Solution Approach 1:
The connection structure is segmented into two parts: a standard-height thermally conductive bump for thermal conduction and an extended connection terminal for electrical connection. This segmentation allows the thermal conduction path to remain uniform while accommodating components of different heights through the extended terminal portion.
Solution Approach 2:
The connection terminal is designed with dimensional differentiation: the bump portion maintains standard height for optimal thermal contact, while the terminal portion extends vertically to accommodate taller components. This dimensional change allows electrical connection without compromising thermal efficiency.
3Reliability
If all components are covered by sealing resin, then the module is well protected, but heat dissipation from component surfaces is hindered
Solution Approach 1:
The sealing resin is extracted or removed from the areas where heat dissipation is critical. Specifically, the surfaces of electronic components that require heat dissipation are left exposed rather than being completely covered by the sealing resin, allowing thermal energy to escape while maintaining protection in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures consistent heat dissipation across components of varying heights, improving thermal performance compared to traditional thermally conductive bump configurations.
Implementation Method 1
a sealing resin arranged so as to cover the first component and the second component while covering the first main surface
Data Source
AI summary
A module includes a wiring board having a first main surface, a first component mounted on the first main surface and having a first height H1, a second component mounted on the first main surface and having a second height H2 lower than the first height H1, and a sealing resin arranged so as to cover the first component and the second component while covering the first main surface. Compared to a first connection terminal used for connection between the first component and the first main surface, a second connection terminal used for connection between the second component and the first main surface has a higher height. A surface of the first component on a side far from the first main surface and a surface of the second component on a side far from the first main surface are exposed from the sealing resin.