Electronic Module Shield Film Grounding via Protruding Terminal
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Solution Overview
Problem
The existing module designs with shield films formed by physical deposition methods, such as sputtering, exhibit weakened shielding performance below the substrate due to incomplete electrical connection between the shield film and the ground electrode.
Innovation Solution
A module configuration is introduced where a protruding portion is formed on the ground terminal to extend laterally and electrically connect with the shield film covering the side surface of the sealing resin, ensuring enhanced shielding performance below the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield film is formed by physical deposition method such as sputtering, then the shield film can be formed on the side surface of the module, but the shield film thickness decreases toward the lower surface and electrical connection to ground electrode is incomplete, resulting in weakened shielding performance below the substrate
Solution Approach 1:
A protruding portion extending from the ground terminal serves as an intermediary element to bridge the gap between the ground electrode and the shield film on the side surface of the sealing resin. This protruding portion makes contact with the shield film to establish electrical connection, compensating for the insufficient conductivity of the substrate's side surface and ensuring complete grounding of the shield film structure.
Solution Approach 2:
The electrical connection path is extended from the two-dimensional plane of the substrate side surface into the third dimension by introducing a protruding portion that extends laterally from the ground terminal. This dimensional transition allows the ground connection to reach the shield film on the vertical side surface of the sealing resin, ensuring comprehensive electrical connectivity throughout the module structure.
2Area of stationary object
If the shield film extends below the substrate, then coverage area is increased, but electrical connection to ground electrode is lost, reducing shielding effectiveness
Solution Approach 1:
The protruding portion acts as a mediator that extends the electrical connection path to reach the shield film in regions where the substrate's side surface conductivity is insufficient. This ensures that even when the shield film extends below the substrate, reliable electrical connection to the ground electrode is maintained through the protruding portion's contact with the shield film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances shielding performance below the substrate by establishing a direct electrical connection between the ground terminal and the shield film, thereby improving the module's ability to shield electromagnetic interference.
Implementation Method 1
a shield film covering at least a side surface of the first sealing resin... electrically connected to a ground terminal... enhance shielding performance below the substrate
Data Source
AI summary
A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin disposed to cover the first surface and the first component; a shield film covering at least a side surface of the first sealing resin; a first ground terminal mounted on the first surface; and a protruding portion formed to extend laterally at any position of the first ground terminal in a direction parallel to the first surface. The protruding portion is electrically connected to a portion of the shield film that covers the side surface of the first sealing resin.