High-frequency Module Shield Grounding via Vertical Conductor
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Solution Overview
Problem
High-frequency modules with shield layers connected to ground wiring on substrates experience increased shield resistance and reduced design flexibility due to the distance from the shield layer to the ground and the necessity of substrate wiring for ground connection.
Innovation Solution
A high-frequency module design where a shield layer is connected to a ground electrode with the shortest distance using a connection conductor that exposes portions from the sealing resin layers, eliminating the need for substrate wiring and enhancing the connection area for improved shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the shield layer is connected to the ground wiring provided at the substrate, then the shielding effect can be improved, but the shield resistance increases because the distance from the shield layer to the ground increases
Solution Approach 1:
The connection conductor extends in the thickness direction (third dimension) of the substrate to connect the shield layer to the ground electrode. This vertical connection path through the sealing resin layer significantly reduces the connection distance compared to horizontal substrate wiring, thereby lowering shield resistance while maintaining effective shielding.
Solution Approach 2:
The connection conductor acts as an intermediary element that bridges the shield layer and the ground electrode. This mediator provides a dedicated low-resistance electrical path through the sealing resin layer, enabling effective grounding without requiring the shield layer to be in direct contact with the substrate.
2Object-affected harmful factors
If the ground wiring is provided at the substrate, then the shield layer can be connected to ground, but the design flexibility of the substrate decreases
Solution Approach 1:
The grounding function is extracted from the substrate and implemented through the connection conductor that extends from the shield layer through the sealing resin layer to the ground electrode. This separates the grounding function from the substrate's wiring system, allowing the substrate to maintain its original design flexibility while still achieving effective grounding for the shield layer.
3Reliability
If the shield layer is connected to ground with minimal distance, then the shield resistance is reduced, but the connection structure becomes more complex
Solution Approach 1:
The connection conductor is integrated into the sealing resin layer structure, combining the sealing function with the grounding connection function. This merging approach allows the connection conductor to be embedded within the sealing resin layer during the sealing process, reducing overall structural complexity compared to adding a separate grounding mechanism.
Data Source
AI summary
A high-frequency module 1 includes: a substrate 2; a first component 4 mounted on an upper surface 2a of the substrate 2; a second component 5 mounted on a lower surface 2b of the substrate 2; an upper sealing resin layer 6 and a lower sealing resin layer 7; a conductor pin 8; and a shield layer 9. The conductor pin 8 includes a terminal portion 8a exposed from a lower surface 7a of the lower sealing resin layer 7 and connected to a ground electrode of an outer substrate, and a shield connection portion 8b exposed from a side surface 7b of the lower sealing resin layer 7 and connected to the shield layer 9. As a result of the terminal portion 8a of the conductor pin 8 being connected to the ground electrode, the shield layer 9 is connected to a ground potential with the shortest distance therebetween.