Module Shield Layer Electrical Connectivity via Metal Pin
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Solution Overview
Problem
The existing circuit modules with shield layers face inadequate electrical connectivity between the shield layer and the ground electrode due to small contact areas, which compromises the shielding effect.
Innovation Solution
A module design featuring metal pins with extending portions that increase the contact area between the shield layer and the electrode, allowing for improved electrical connectivity and shielding efficacy, while also providing stable fixation and design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the ground electrode is provided inside the circuit substrate and exposed from side surfaces, then the shield layer can be formed on the sealing resin layer, but the contact area between the shield layer and ground electrode is small resulting in poor electrical connectivity
Solution Approach 1:
The ground electrode is extended from the side surface exposure (one-dimensional contact) to include a surface extending along the sealing resin layer (two-dimensional contact). This dimensional expansion increases the contact area between the ground electrode and shield layer, improving electrical connectivity while maintaining the same shield layer structure.
Solution Approach 2:
The ground electrode is pre-configured with an extended surface area before the shield layer is applied. This preliminary preparation ensures that when the shield layer is formed, there is already sufficient contact area available, eliminating the need for post-processing and ensuring reliable electrical connectivity from the outset.
2Reliability
If the ground electrode is extended to increase contact area, then electrical connectivity improves, but the device structure becomes more complex
Solution Approach 1:
The ground electrode structure is merged with the sealing resin layer configuration. The ground electrode's extended surface follows the contour and positioning of the sealing resin layer, combining two functional elements into a coordinated structure. This integration increases contact area while avoiding separate complex components.
Solution Approach 2:
The extended ground electrode surface serves multiple functions: it provides electrical connectivity to the shield layer, maintains structural integrity with the sealing resin layer, and facilitates the formation of the shield layer itself. This multi-functionality reduces the need for additional specialized components.
Data Source
AI summary
A module includes a wiring substrate; a component; a metal pin attached to a land electrode formed at one main surface and has a first extending portion extends from the one main surface, a second extending portion that is bent and extends from one end of the first extending portion on an opposite side from the one end surface, and a third extending portion that is bent and extends from one end of the second extending portion on an opposite side from the first extending portion to approach the one main surface; a sealing resin layer that covers the one main surface, the component, and the metal pin; and a shield layer that covers a side surface of the wiring substrate, a surface of the sealing resin layer, and the upper surface and the side outer surface of the metal pin.