Electronic Component Module Shield Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic component modules with components mounted on both surfaces of a board, electromagnetic waves radiated from one surface can interfere with components on the other surface due to the existing shielding methods, which may not effectively prevent cross-talk and can lead to electrical connections between shields.
Innovation Solution
The module design incorporates protrusions on the side surfaces of the board to physically separate shields covering the mold portions and side surfaces, preventing electromagnetic wave transmission between surfaces and ensuring reliable insulation and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield covers the entire board including both surfaces and side surfaces to suppress electromagnetic wave leakage, then the radiation of electromagnetic waves to the outside is prevented, but electromagnetic waves from one surface can be transmitted to the other surface through the shield, causing interference to components on the opposite surface
Solution Approach 1:
The shield is divided into a first shield covering the front surface and a second shield covering the back surface, with the protrusion separating them. This segmentation prevents electromagnetic waves from one surface from being transmitted to the other surface through a continuous shield structure, while each shield still provides effective shielding for its respective surface.
Solution Approach 2:
A protrusion structure is introduced as an intermediary element between the two shields. This protrusion physically separates the first and second shields, creating an air gap that acts as an electromagnetic isolation barrier, preventing direct transmission of electromagnetic waves between surfaces while maintaining the shielding function.
2Object-affected harmful factors
If a continuous shield structure is used to cover the board periphery, then electromagnetic wave leakage is suppressed, but electrical connections between shields may occur leading to reduced shielding effectiveness
Solution Approach 1:
The continuous shield structure is segmented into two separate shields by the protrusion. This physical separation eliminates the risk of electrical connections between shields that would occur in a continuous shield structure, ensuring reliable electrical insulation while maintaining electromagnetic wave suppression capability.
Solution Approach 2:
The protrusion serves as an intermediary insulating structure between the two shields. This intermediate element provides both mechanical separation and electrical insulation, preventing unwanted electrical connections while allowing each shield to function independently for suppressing electromagnetic wave leakage.
3Object-affected harmful factors
If the shield covers the entire board including side surfaces, then comprehensive electromagnetic shielding is achieved, but the complexity of the shield structure and manufacturing process increases
Solution Approach 1:
The shield structure is segmented into two separate shields positioned on opposite surfaces, simplifying the overall structure compared to a single continuous shield covering all surfaces. This segmentation reduces manufacturing complexity while achieving comprehensive electromagnetic shielding through the combined action of both shields and the separating protrusion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses electromagnetic interference (EMI) by preventing electromagnetic waves from one surface from reaching components on the other surface, while maintaining reliable electrical connectivity to ground potential, thus enhancing the shielding effectiveness and module stability.
Implementation Method 1
a shield covering at least a part of the mold portions and the side surfaces... prevent the electromagnetic waves radiated from the device disposed on the front surface side of the board from being transmitted to the electronic components mounted on the back surface with the shield interposed therebetween
Data Source
AI summary
An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).