Electronic Component Module Shield Layer Recesses Prevent Resin Burrs
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Solution Overview
Problem
Existing methods for manufacturing electronic component modules result in increased height due to conductive-resin burrs and projections on the shield layer, making it difficult to reduce the overall height of the modules.
Innovation Solution
A method involving the formation of recesses on the shield layer by adjusting the width and curing of conductive resin-filled grooves, allowing for the reduction of module height by preventing conductive-resin burrs and projections from affecting the module's height, achieved through specific steps of substrate cutting, conductive resin application, and shaping techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the aggregate substrate is fully cut using a dicer to singulate circuit modules, then the modules are separated into individual units, but conductive-resin burrs are formed on the shield layer increasing module height
Solution Approach 1:
The patent applies preliminary action by forming recesses in the shield layer at groove positions before the dicing process. This preliminary structural preparation ensures that when the dicer cuts through the aggregate substrate, any conductive-resin burrs formed during cutting will fall into these pre-formed recesses rather than protruding from the module surface, thus preventing height increase while maintaining efficient module singulation
2Reliability
If grooves are filled with conductive resin to form a shield layer, then electromagnetic shielding is achieved, but conductive-resin projections are formed on the shield layer surface
Solution Approach 1:
The patent applies local quality by creating localized recesses in the shield layer specifically at the groove positions where conductive resin is filled. These recesses are formed only where needed to contain potential burrs, while the rest of the shield layer maintains its electromagnetic shielding function. This localized structural modification allows the shield layer to simultaneously provide electromagnetic shielding and maintain a flat outer surface
3Manufacturing precision
If the dicer cuts through the aggregate substrate from the outer surface, then complete separation is achieved, but the cutting tool contacts and forms burrs on the conductive resin
Solution Approach 1:
The patent converts the harmful effect of burr formation into a beneficial outcome by designing recesses that intentionally accommodate these burrs. Instead of trying to prevent burr formation during cutting, the invention accepts that burrs will form but provides a predetermined space (recess) for them, transforming what would be a defect into a controlled feature that does not affect the final module dimensions or quality
Data Source
AI summary
A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules.