Electronic Component Module Shielding With Stepped Magnetic Cover Sheet

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Solution Overview

Problem

Conventional electronic component modules with a magnetic layer and metal layer face issues where burrs on the cover sheet of the magnetic layer can protrude, leading to a reduced shielding effect of the metal layer due to division and blocking, making it difficult to form a continuous metal layer on the magnetic main body.

Innovation Solution

The electronic component module design includes a magnetic layer with a cover sheet configuration where the second main surface of the cover sheet faces the metal layer, and its outer peripheral end is located inside the first main surface, allowing for continuous formation of the metal layer without division, thereby maintaining the shielding effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a magnetic layer with a cover sheet is used, then the magnetic layer can be easily manufactured, but burrs may be generated on the cover sheet during cutting, causing the side face to protrude outward and divide the metal layer, reducing the shielding effect

Engineering Contradiction:
Improveease of manufacture of magnetic layerVSAvoidshielding effect of metal layer
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A resin layer is introduced as an intermediary between the magnetic main body and the metal layer. This resin layer acts as a buffer that prevents the metal layer from directly contacting the protruding cover sheet, thereby maintaining the continuity and integrity of the metal layer while still allowing the magnetic layer structure to be used for ease of manufacture

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The magnetic layer is segmented into two distinct parts: a magnetic main body and a cover sheet. The cover sheet is designed with its outer peripheral end positioned inside the outer peripheral end of the first main surface, creating a stepped structure that prevents protrusion and metal layer division

Inventive Principle:
Principle #1Segmentation

2Reliability

If the outer peripheral end of the second main surface of the cover sheet is located inside the outer peripheral end of the first main surface, then the metal layer can be formed continuously without division, but the cover sheet structure becomes more complex

Engineering Contradiction:
Improvecontinuity of metal layerVSAvoidcomplexity of cover sheet structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cover sheet is designed with an asymmetric stepped structure where the outer peripheral end of the second main surface is positioned inside the outer peripheral end of the first main surface. This asymmetric configuration prevents the cover sheet from protruding outward and dividing the metal layer, while the step depth is controlled to minimize structural complexity

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS11744005B2Electronic component module and manufacturing method of electronic component module
Publication Date: 2023.08.29 MURATA MFG CO LTD
  • US11744005B2 patent drawing
  • US11744005B2 patent drawing
  • US11744005B2 patent drawing

AI summary

An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.