Module Shielding Design for Compact Communication Devices
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Solution Overview
Problem
Current module designs for communication devices face challenges in providing both electromagnetic and magnetic shielding while maintaining high component density and securing a mounting area, as existing shielding members typically only offer one type of shielding function.
Innovation Solution
A module design incorporating a substrate with electronic components, a sealing resin, a ground electrode, a conductive layer, and a magnetic member, where the conductive layer acts as an electromagnetic shield and the magnetic member provides magnetic shielding, with connecting conductors overlapping with magnetic member wall-shaped portions to ensure both types of shielding without compromising the mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If component mounting density is increased to reduce size, then device compactness is improved, but shielding effectiveness deteriorates
Solution Approach 1:
The patent transitions from planar shielding arrangements to a three-dimensional layered shielding structure. By stacking conductive and magnetic layers vertically above the mounting surface, the shielding effectiveness is enhanced in the vertical dimension without increasing the horizontal footprint, thus maintaining device compactness while improving shielding performance.
Solution Approach 2:
The shielding structure is nested directly over the mounting surface, with the conductive and magnetic layers positioned above the electronic components. This nested arrangement provides comprehensive shielding coverage without adding lateral space, allowing high component density to be maintained while achieving effective shielding.
2Device complexity
If a single functional shielding member is used, then device complexity is reduced, but dual shielding capability is lost
Solution Approach 1:
The shielding member is designed as a multi-functional component that simultaneously provides both electromagnetic shielding and magnetic shielding capabilities. By integrating multiple shielding functions into a single structural unit, the patent reduces the number of separate components needed while maintaining comprehensive shielding performance, thus resolving the contradiction between simplicity and functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively satisfies both electromagnetic and magnetic shielding requirements while preserving the mounting area, enhancing shielding strength and preventing structural issues like warpage due to resin curing or thermal expansion.
Implementation Method 1
a conductive layer 6 covering the sealing resin 3... the conductive layer 6 acts as an electromagnetic shield
Implementation Method 2
a magnetic member 5... the magnetic member 5 provides magnetic shielding
Data Source
AI summary
A module (101) is provided with a substrate including a principal surface (1u), a plurality of electronic components (41, 42, and 43) arranged on the principal surface (1u), a sealing resin (3) covering the principal surface (1u), a ground electrode arranged on the principal surface (1u), a conductive layer (6) covering the sealing resin (3), and a magnetic member (5). The conductive layer (6) is electrically connected to the ground electrode by a plurality of connecting conductors (62) arranged so as to penetrate the sealing resin (3), and the magnetic member (5) includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin (3) and a magnetic member wall-shaped portion (52) arranged in a wall shape in the sealing resin (3). The magnetic member wall-shaped portion (52) is longer than each of the connecting conductors (62).


