Electronic Component Module Shielding With Low-Resistance Resin Connection
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Solution Overview
Problem
The conductive posts in existing electronic component modules have higher resistivity due to the inclusion of synthetic resin binders, and as surface mounting components become smaller, the resistivity increases further, leading to higher connection resistance between the surface mounting components and the conductive films.
Innovation Solution
The electronic component module incorporates a conductive auxiliary layer on the side of the electronic component opposite to the substrate, which is covered by a recessed portion of the sealing resin, allowing for a direct connection to the conductive film with reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive paste containing synthetic resin binder is used to form conductive post, then ease of manufacture is improved, but electrical conductivity deteriorates due to higher resistivity
Solution Approach 1:
The conductive connection path is segmented into two parts: a conductive auxiliary layer formed with conductive paste containing synthetic resin binder (easy to manufacture), and a conductive film formed without synthetic resin binder (high conductivity). This segmentation allows each part to optimize for its specific function while resolving the contradiction between ease of manufacture and electrical conductivity.
Solution Approach 2:
The conductive auxiliary layer acts as an intermediary between the external electrode and the conductive film. It provides a transition zone that is easier to manufacture while the conductive film provides the low-resistance connection path, thus mediating between manufacturing ease and electrical conductivity requirements.
2Volume of moving object
If surface mounting component size is reduced, then device miniaturization is improved, but connection resistance increases due to smaller external electrode cross-sectional area
Solution Approach 1:
The connection path is extended into a new dimensional space by forming a conductive film on the outer surface of the sealing resin that overlaps with the conductive auxiliary layer. This additional dimensional path compensates for the reduced cross-sectional area of the external electrode in miniaturized components, maintaining low connection resistance despite smaller component size.
Data Source
AI summary
An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.