Semiconductor Module Sintering With Gas-Release Cushioning Layout
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Solution Overview
Problem
In semiconductor module manufacturing, thick cushioning materials used for sintering can inhibit gas discharge from sintered materials, leading to deposits on the insulating substrate, reducing solderability and causing voids in sealing resins, which increases manufacturing costs and decreases reliability.
Innovation Solution
A method involving an insulating wiring substrate with electrically-conductive patterns, where sintered materials are pressed and heated via a cushioning material and electronic components, with a space maintained between the upper hot plate and the insulating substrate to allow gas discharge, preventing deposits on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If a thick cushioning material is used to equalize pressure during sintering, then pressure equalization is improved, but gas discharge is inhibited leading to deposits on the substrate
Solution Approach 1:
The cushioning material is divided into multiple layers with different thicknesses. The first cushioning material layer has a first thickness and the second cushioning material layer has a second thickness greater than the first thickness. This segmentation allows the thicker portion to provide pressure equalization while the thinner portion allows gas discharge, resolving the contradiction between pressure equalization and gas discharge inhibition.
Solution Approach 2:
Different regions of the cushioning material structure are assigned different thicknesses based on their functional requirements. The region requiring pressure equalization has greater thickness, while the region requiring gas discharge has lesser thickness. This local differentiation of quality (thickness) allows simultaneous achievement of pressure equalization and gas discharge.
2Reliability
If sintering is performed to achieve high heat-resisting property and high reliability, then joining strength is improved, but gas generation and deposit formation increase
Solution Approach 1:
The cushioning material acts as an intermediary structure between the substrate and the sintered materials. It mediates the contradiction by providing a controlled path for gas discharge while maintaining the pressure and temperature conditions necessary for reliable sintering. The differentiated thickness structure allows it to simultaneously protect the substrate from direct gas contact while enabling gas escape.
3Stress or pressure
If cushioning material completely covers the surrounding of electronic component, then pressure equalization is improved, but gas discharge path is blocked
Solution Approach 1:
The cushioning material structure is segmented into different thickness zones. The first cushioning material layer provides coverage for pressure equalization, while the second cushioning material layer with greater thickness creates openings or reduced coverage areas that serve as gas discharge paths. This segmentation allows the cushioning material to simultaneously achieve complete coverage for pressure distribution and provide escape paths for gas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces defects and manufacturing costs by ensuring gas discharge occurs outside the module, maintaining solderability and enhancing reliability by preventing deposits on the substrate.
Implementation Method 1
sintering the sintered materials by pressurizing and heating the sintered materials via the cushioning material and the electronic components by the upper hot plate
Implementation Method 2
sintering the sintered materials by pressurizing and heating the sintered materials
Implementation Method 3
a cushioning material is used to absorb irregularities or unevenness in height on the surface of the electronic component
Data Source
AI summary
A method of manufacturing a semiconductor module includes: placing, on a lower hot plate, an insulating wiring substrate having an electrically-conductive pattern formed on an insulating substrate; placing sintered materials on the electrically-conductive pattern; placing semiconductor chips on the sintered materials; placing a cushioning material over the semiconductor chips; placing an upper hot plate on the cushioning material; and sintering the sintered materials by pressurizing and heating the sintered materials via the cushioning material and the electronic components by the upper hot plate in a state where a space is provided between the upper hot plate and a part of the insulating substrate.