Power Semiconductor Module Sleeve Forming for Clean Terminal Coupling

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Solution Overview

Problem

Existing methods for forming sleeves or rivets in power semiconductor modules often create contaminants that can affect the module's functionality, and require significant space and complex tools for coupling, making them inefficient and costly.

Innovation Solution

A method involving a punch to exert a pressing force on a metal layer, causing the material to flow and form a sleeve either upwards or downwards, eliminating the need for separate connection procedures and minimizing contamination, by using a shaping tool to control the sleeve's shape and thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional methods are used to form sleeves or rivets in power semiconductor modules, then terminal elements can be coupled to the metal layer, but contaminants are created that affect module functionality

Engineering Contradiction:

Improvemodule functionalityVSAvoidcontaminants

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The invention extracts and eliminates the harmful byproduct (contaminants) from the sleeve forming process. By using a punch tool that displaces metal layer material to form sleeves without generating particulate contamination, the method removes the source of reliability issues while maintaining the essential function of coupling terminal elements to the metal layer.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention converts the potential harm of material removal into a benefit by using material displacement instead. Rather than removing material (which creates contaminants), the punch tool displaces the metal layer material to form the sleeve structure, transforming a harmful process into a clean, beneficial forming mechanism.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If conventional coupling methods are used for terminal elements, then electrical connection is achieved, but significant space and complex tools are required

Engineering Contradiction:

Improveelectrical couplingVSAvoidtool complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention merges the functions of creating the sleeve structure and forming the electrical connection into a single integrated punch tool operation. The punch tool simultaneously forms the sleeve from the metal layer material and creates the coupling structure for terminal elements, eliminating the need for separate connection procedures and reducing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The punch tool is designed with multi-functionality, serving both to form the sleeve structure and to create the electrical coupling mechanism in one operation. This universal tool replaces multiple specialized tools, reducing complexity while achieving reliable electrical coupling.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If conventional coupling methods are used, then terminal elements can be connected to the metal layer, but additional space is required

Engineering Contradiction:

Improvemechanical couplingVSAvoidspace requirement

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The invention implements a nested structure where the terminal element is inserted into and coupled with the sleeve that is formed from the metal layer itself. This nesting arrangement allows the coupling structure to be compact and integrated within the existing module footprint, reducing the additional space required compared to conventional external coupling methods.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for efficient and cost-effective mechanical and electrical coupling of terminal elements to the metal layer without creating contaminants, simplifying the process and reducing the need for additional space, thereby enhancing the reliability and efficiency of power semiconductor modules.

Implementation Method 1

a punch (92) is pressed against a section of a first surface (101) of a metal layer (110) with a pressing force that forces material of the metal layer (110) to flow

Methodology Applied

Scientific EffectPlastic deformation: Plasticity

Data Source

PatentUS20240162048A1Method for forming a power semiconductor module arrangement

Publication Date: 2024.05.16 INFINEON TECHNOLOGIES AG

AI summary

A method includes exerting a pressing force on a section of a first surface of a metal layer by a punch. Either the metal layer is arranged on a working surface with a second surface of the metal layer facing the working surface, the second surface being arranged opposite the first surface, and the punch is pressed against the section of the first surface with a pressing force that forces material of the metal layer to flow up against a stroke of the punch, thereby forming a sleeve extending from the first surface in a vertical direction and away from the second surface, or the punch is pressed against the section of the first surface and forced through the metal layer towards the second surface with a pressing force that forces material of the metal layer to flow down with a stroke of the punch, thereby forming a sleeve extending from the second surface in a vertical direction and away from the first surface. The method further includes, after forming the sleeve, arranging the metal layer in a housing of a power semiconductor module.