Module Substrate Embedding Duplexers for Band Standardization
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Solution Overview
Problem
The complexity and increased production cost of mobile communication devices arise from the need to customize duplexer embedding for different countries' frequency standards, as existing technologies require separate processes for each country due to the dependency of duplexer type on country-specific frequency bands.
Innovation Solution
A module substrate with a multilayered wiring substrate embedding duplexers for commonly used general bands (Band1, Band2, Band5, and Band8) and surface-mounting duplexers for regional bands, allowing for standardized production and cost reduction by simplifying the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If duplexers are embedded in the multilayered wiring substrate to reduce device size, then the device downsizing is achieved, but the production process becomes complicated and production cost increases due to country-specific customization requirements
Solution Approach 1:
The duplexer functionality is segmented into two parts: country-common bands (Band1, Band2, Band5, Band8) are embedded in the substrate, while country-specific bands are mounted separately on the surface. This segmentation allows standardized production of the embedded portion while enabling flexible customization of the surface-mounted portion for different countries.
Solution Approach 2:
The multilayered wiring substrate is designed with universal embedding capability for common band duplexers that can be used across multiple countries. The surface then provides universal mounting capability for additional country-specific duplexers, making the same substrate design applicable to multiple country configurations.
2Adaptability or versatility
If separate embedding processes are performed for each country's duplexer type, then country-specific frequency standards are met, but production cost increases
Solution Approach 1:
The production process is segmented into a standardized embedding phase for common bands and a flexible surface mounting phase for country-specific bands. This allows the majority of production to be standardized and automated, reducing costs while maintaining the ability to customize for different countries.
Solution Approach 2:
The country-common duplexer embedding is performed in advance during standardized production. Later, country-specific duplexers are added through surface mounting. This preliminary action for the common portion enables cost-effective mass production while preserving customization flexibility.
3Ease of manufacture
If only commonly used general bands are embedded and regional band duplexers are mounted externally, then production is standardized and costs are reduced, but device structure becomes more complex
Solution Approach 1:
The duplexer system is segmented into embedded components for common bands and surface-mounted components for regional bands. This segmentation simplifies manufacturing through standardization of the embedded portion while managing structural complexity through modular surface mounting of regional components.
Data Source
AI summary
A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.