Module Substrate Opening for Short-Circuit Prevention
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Solution Overview
Problem
The increasing density and miniaturization of modules lead to narrower gaps between components, increasing the likelihood of short-circuiting between electrodes or solder bumps during mounting on a motherboard, resulting in unstable mounting and potential failures.
Innovation Solution
A module design featuring a substrate with a first surface, a first land electrode, and an insulating film that partially covers the land electrode, with a first opening that accommodates conductive material, preventing overflow and ensuring stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are mounted densely on a substrate to reduce module size, then productivity and miniaturization are improved, but the risk of short-circuiting between electrodes or solder bumps increases
Solution Approach 1:
An insulating film is introduced as an intermediary substance between adjacent land electrodes to prevent direct contact and short-circuiting. The insulating film is applied to portions of land electrodes that are not to be connected to electronic components, creating a protective barrier that maintains electrical isolation while allowing dense component mounting.
Solution Approach 2:
The insulating film is selectively applied only to specific portions of land electrodes where isolation is needed, rather than covering the entire electrode surface. This localized application maintains electrical connectivity where required while providing insulation where needed, enabling dense packaging without compromising reliability.
2Device complexity
If a coreless package structure is used to reduce profile height, then device complexity is reduced, but mounting stability deteriorates due to excess or shortage of solder
Solution Approach 1:
The insulating film is pre-applied to land electrodes before component mounting to establish precise boundaries for solder application. This preliminary action ensures that solder is applied only to intended areas, preventing both excess solder that could cause short-circuiting and shortage of solder that would lead to poor connections.
3Productivity
If the gap between terminal electrodes is reduced to increase component density, then productivity is improved, but manufacturing precision requirements increase due to higher short-circuiting risk
Solution Approach 1:
The insulating film serves as a mediator that eliminates the need for precise gap control between electrodes. By providing a physical and electrical barrier, the insulating film allows electrodes to be placed closer together without increasing short-circuiting risk, thereby relaxing manufacturing precision requirements while maintaining high component density.
Data Source
AI summary
A module includes a substrate including a first surface, a first land electrode arranged on the first surface, and a first electronic component mounted on the substrate with the first land electrode being interposed. The substrate is provided with a first opening that passes through the substrate in a direction of thickness within a projection area of the first land electrode.