Module Substrate Optical Waveguide Integration for High-Speed Signal Transmission
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Solution Overview
Problem
Conventional signal transmission methods using electric wiring face limitations such as wiring delay, electromagnetic noise, and impedance mismatching, especially at high frequencies, restricting the processing speed of electronic devices, whereas optical waveguides offer faster transmission but require complex integration with electric wiring without complicating production steps.
Innovation Solution
A module substrate with an optical transmission mechanism incorporating an optical waveguide, light emitting/receiving elements, driver components, and circuit components, integrated with build-up layers and wiring patterns to enable high-speed signal transmission while minimizing wiring length and production complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If an optical waveguide is formed in a wiring substrate on which an IC is mounted, then optical signal transmission is enabled for high-speed signal transmission, but the structure becomes complex and production steps are complicated
Solution Approach 1:
The patent merges the optical waveguide structure with the existing wiring substrate structure by forming the optical waveguide in the same substrate that mounts the IC. This integration allows optical signal transmission while utilizing the existing substrate infrastructure, thereby reducing overall structural complexity rather than adding separate optical components.
Solution Approach 2:
The wiring substrate is designed to serve dual functions: it acts as both the mechanical support for the IC and the medium for optical waveguide formation. This multi-functionality eliminates the need for separate optical and electrical substrates, simplifying the overall device structure while enabling high-speed optical transmission.
2Speed
If the electric wiring and the optical waveguide are placed while they are surely combined with each other, then signal transmission is performed at higher speed, but the production steps are complicated
Solution Approach 1:
The optical waveguide is formed in the wiring substrate before the IC is mounted onto the substrate. This preliminary formation of the optical structure allows subsequent IC mounting and wiring connections to proceed without disrupting the optical waveguide, thereby simplifying the overall production process while ensuring high-speed signal transmission capability.
Solution Approach 2:
The production process is segmented into distinct stages: first forming the optical waveguide in the substrate, then mounting the IC, and finally establishing electrical connections. This segmentation allows each step to be optimized independently, making the overall manufacturing process more manageable and less complicated despite the integration of optical and electrical systems.
3Loss of time
If a signal transmission path using light is placed to shorten the signal transmission path using electric wiring, then signal transmission speed is increased, but the integration with electric wiring becomes complex
Solution Approach 1:
The patent transitions from two-dimensional planar wiring to three-dimensional optical waveguide structure within the substrate. By utilizing the vertical dimension and embedding the optical waveguide within the substrate thickness, the system achieves shorter transmission paths without increasing lateral complexity, thereby reducing signal delay while maintaining integration simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module substrate allows for compact and efficient optical signal transmission, reducing signal delay and electromagnetic noise, and enabling faster signal processing speeds without complicating production processes.
Implementation Method 1
an optical transmission mechanism including an optical waveguide
Data Source
AI summary
A module substrate is provided. The module substrate includes: a core portion; a build-up layer formed on the core portion and including a wiring pattern and an insulating layer; an optical transmission mechanism including: an optical transmission component including an optical waveguide, and a mounting portion on which a semiconductor element is to be mounted. The mounting portion is electrically connected to the optical transmission mechanism via the wiring pattern. The mounting portion includes a first mounting portion and a second mounting portion, and the optical transmission mechanism is disposed between the first mounting portion and the second mounting portion.