Semiconductor Module Substrate With Pin-Holding Thin Film Testing
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Solution Overview
Problem
Miniaturized semiconductor storage devices like SSDs face electrical hazards such as shorts, electrical over stress, internal power resets, and electrostatic discharge when connected to metal shields, necessitating a method to analyze abnormalities and prevent these issues during testing.
Innovation Solution
A module substrate with a wiring substrate, via holes, test terminals, and a fastening thin film that allows interface inspection pins to penetrate and hold the pins in place, preventing separation and ensuring stable contact during testing, and a test socket with rotating bodies and interface inspection pins to perform reliability tests.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interface inspection pins are inserted through via holes to test semiconductor devices, then electrical testing can be performed, but short circuits and electrical shocks may occur due to poor contact or separation
Solution Approach 1:
A fastening thin film is introduced as an intermediary layer between the interface inspection pin and the via hole. This thin film penetrates during pin insertion and provides frictional resistance to hold the pin in place, ensuring stable electrical contact and preventing separation that could cause testing failures or electrical hazards
Solution Approach 2:
The thickness of the fastening thin film is precisely controlled within a specific range (1-200 μm) to achieve optimal performance. The thickness parameter is changed to balance between allowing sufficient pin penetration for stable contact while maintaining enough material to provide adequate frictional holding force and prevent electrical hazards
2Stability of the object's composition
If the fastening thin film is made thicker to hold pins more securely, then contact stability improves, but pin insertion difficulty and manufacturing complexity increase
Solution Approach 1:
The thickness of the fastening thin film is optimized within a specific range (1-200 μm) to achieve the right balance between holding force and insertability. This parameter optimization ensures sufficient frictional resistance for stable contact while maintaining reasonable manufacturing feasibility and pin insertion ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents short circuits and electrical shocks by ensuring secure contact between interface inspection pins and test terminals, effectively addressing electrical hazards in miniaturized storage devices during testing.
Implementation Method 1
a portion of the penetrated fastening thin film contacts and holds the penetrating interface inspection pin
Data Source
AI summary
A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.