Module Substrate With Through-Groove Test Terminals
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Solution Overview
Problem
In memory modules with a small form factor, it is challenging to secure design space for test terminals while meeting design regulations, especially as the number of electronic components increases.
Innovation Solution
The implementation of a module substrate with a wiring substrate featuring through-groove test terminals, where contact pads are exposed from the inner wall of through grooves, allowing for efficient placement of interface signal connection terminals on the sidewall and improving contact reliability with inspection pogo pins without exposing copper contact pads from the sidewall.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of electronic components on the module substrate is increased, then the functionality and integration of the memory module is improved, but the available design space for test terminals is reduced
Solution Approach 1:
The patent relocates test terminals from the traditional planar surface of the module substrate to the vertical sidewall surface through through-grooves. This dimensional transition from 2D surface mounting to 3D vertical integration allows test terminals to coexist with increased electronic components on the substrate without compromising available design space.
2Area of moving object
If the module substrate form factor is reduced, then the compactness and integration of the memory module is improved, but the design space for test terminals becomes insufficient
Solution Approach 1:
By forming through-grooves that extend vertically through the substrate thickness and exposing contact pads on the sidewall, the patent creates additional test terminal space in the vertical dimension. This allows compact substrate designs to maintain adequate test terminal accessibility without increasing the substrate's planar footprint.
Solution Approach 2:
The patent concentrates test terminal structures in specific localized regions along the sidewall through selective formation of through-grooves. This localized approach allows test terminals to be positioned in areas that do not interfere with the placement of electronic components on the substrate surface, optimizing both compactness and test accessibility.
3Reliability
If copper contact pads are exposed from the sidewall, then the contact reliability with inspection pogo pins is improved, but the compliance with PCB design regulations is compromised
Solution Approach 1:
The patent introduces an insulating layer that selectively covers portions of the sidewall while leaving contact pad surfaces exposed in controlled locations. This intermediary insulating structure enables reliable electrical contact with inspection pogo pins while simultaneously preventing unauthorized copper exposure that would violate PCB design regulations regarding electromagnetic interference and signal integrity.
Data Source
AI summary
A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.