Module Connection Terminal Isolation via Vertical Via Structure
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Solution Overview
Problem
Conventional modules with narrowed connection terminal intervals experience degraded isolation between terminals, leading to reduced electrical characteristics.
Innovation Solution
A module design featuring a substrate with an electronic component, first and second sealing resins, and connection terminals, where the second connection terminal is larger in area and positioned on a straight line connecting the first connection terminals, enhancing electrical isolation and allowing for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the interval between connection terminals is narrowed to reduce module size, then the module size is reduced, but the isolation between connection terminals is degraded
Solution Approach 1:
The patent introduces a via structure that extends vertically through the substrate, adding a third dimension to the connection terminal configuration. This via structure provides additional isolation between adjacent connection terminals on the same surface by creating electrical separation through the substrate thickness, thereby maintaining isolation performance while allowing narrower horizontal spacing between terminals.
Solution Approach 2:
The via structure acts as an intermediary element between connection terminals on the first surface and connection terminals on the second surface. By positioning the via between adjacent terminals and using it as a reference for determining terminal intervals, the patent ensures adequate isolation is maintained even when terminals are closely spaced, as the via serves as a physical and electrical barrier.
2Volume of moving object
If the interval between connection terminals is narrowed to reduce module size, then the module size is reduced, but the electrical characteristics are degraded
Solution Approach 1:
The via structure extends in the vertical dimension through the substrate, providing additional electrical isolation pathways. This three-dimensional configuration allows the patent to maintain proper electrical characteristics by creating isolation barriers through the substrate thickness, enabling narrower horizontal spacing between terminals without compromising electrical performance.
Solution Approach 2:
The patent determines connection terminal intervals based on via dimensions (diameter and depth) rather than solely on substrate surface spacing. By changing the parameter basis from two-dimensional surface distance to three-dimensional via-based spacing, the patent can maintain appropriate electrical isolation even with narrower terminal intervals, thus preserving electrical characteristics while reducing module size.
Data Source
AI summary
A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection.