Electronic Module Terminal Overlap for Surface Area Reduction

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Solution Overview

Problem

Conventional electronic modules with stacked electronic elements face increased size in the surface direction due to the need for additional terminals, which complicates space arrangement and size management.

Innovation Solution

The electronic module design incorporates first and second substrates with corresponding electronic elements, featuring terminal parts that extend along the substrate surfaces and overlap, allowing terminal arrangement on both substrates to minimize surface size without increasing the module's dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic elements are stacked in layered state to increase number of elements, then functional integration is improved, but the number of terminals increases requiring more space in surface direction

Engineering Contradiction:
Improvenumber of electronic elementsVSAvoidsurface size
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent applies dimensionality change by transitioning from planar terminal arrangement to three-dimensional overlapping arrangement. Terminal parts are configured to extend in multiple directions (first direction along substrate surface, second direction perpendicular to substrate) and overlap when viewed from above, effectively utilizing vertical space to reduce surface footprint while accommodating increased terminal count for stacked electronic elements

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If terminals are provided only to one substrate to simplify connection, then device complexity is reduced, but space for arranging terminals increases surface size

Engineering Contradiction:
Improveterminal arrangement complexityVSAvoidsurface size
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The patent merges terminal arrangement functions across multiple substrates by configuring terminal parts on both first and second substrates to overlap in the vertical direction. This combined approach allows terminals to be distributed across substrates rather than concentrated on one substrate, reducing surface area requirements while maintaining manageable complexity through systematic overlapping configuration

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11658109B2Electronic module
Publication Date: 2023.05.23 SHINDENGEN ELECTRIC MANUFACTURING CO LTD
  • US11658109B2 patent drawing
  • US11658109B2 patent drawing
  • US11658109B2 patent drawing

AI summary

An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending part 113 extending toward one side or the other side. The second terminal part 120 has a second surface direction extending part 124 and a second normal direction extending part 123 extending toward one side or the other side. The second surface direction extending part 124 is provided on one side of the first surface direction extending part 114, and the first surface direction extending part 114 and the second surface direction extending part 124 overlap one another in a surface direction.