Electronic Component Module Through Wiring Adhesion Layer
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Solution Overview
Problem
Existing electronic component modules face issues with low adhesion between resin and metal, leading to a high likelihood of through wiring detachment from the resin structure body.
Innovation Solution
Incorporating a close-contact layer with an inorganic insulation film between the resin structure body and through wiring, which enhances adhesion and prevents detachment, while also providing moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through wiring is covered by a resin structure body, then the through wiring is protected and integrated into the module, but adhesion between the through wiring and resin structure body is low, resulting in easy detachment
Solution Approach 1:
An inorganic insulation film is introduced as an intermediary layer between the through wiring (metal) and the resin structure body. This film serves as a mediator that improves adhesion between the metal through wiring and the resin, preventing detachment while maintaining the protective covering function. The inorganic insulation film is formed on the through wiring before the resin structure body is applied, creating a three-layer structure that resolves the adhesion problem.
2Reliability
If adhesion between resin and metal is low, then the manufacturing process is simpler, but the through wiring easily detaches from the resin structure body
Solution Approach 1:
The inorganic insulation film is formed on the through wiring in advance, before the resin structure body is applied. This preliminary action of coating the through wiring with the insulation film ensures that when the resin is subsequently applied, the adhesion interface is already optimized. The close-contact layer is prepared beforehand to prevent detachment issues that would otherwise require complex retroactive repairs or redesigns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The close-contact layer ensures reliable electrical connections and improved moisture resistance by maintaining the integrity of the through wiring within the resin structure body, reducing the risk of detachment and enhancing the module's reliability.
Implementation Method 1
adhesion between resin and metal is low, and thus, in the existing electronic component module described in Japanese Unexamined Patent Application Publication No. 2005-310954, adhesion between the through wiring and the resin structure body is low
Implementation Method 2
The close-contact layer includes an inorganic insulation film... providing moisture resistance
Data Source
AI summary
An electronic component module includes an electronic component, a resin structure body, a through wiring, a wiring layer, and a close-contact layer. The resin structure body covers at least a portion of the electronic component. The through wiring extends through the resin structure body. The wiring layer electrically connects the electronic component and the through wiring to each other. The close-contact layer is provided between the resin structure body and the through wiring and is in contact with the resin structure body and the through wiring. The close-contact layer includes an inorganic insulation film.