Module Tray Cover Structure for Multi-Directional Lot Card Retention

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Solution Overview

Problem

Existing module trays for semiconductor devices lack efficient and stable mechanisms for accommodating and protecting semiconductor substrates and associated data cards, particularly in terms of horizontal and vertical insertion and retention of lot cards, which are crucial for semiconductor production management.

Innovation Solution

A cover structure for module trays is designed with a card accommodation portion featuring multiple brackets and guides that allow for horizontal and perpendicular insertion of lot cards, providing secure and defined spaces for data cards, while also protecting the semiconductor substrates from external impacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a simple cover structure is used, then manufacturing cost and device complexity are reduced, but the ability to accommodate and protect data cards in multiple directions is lost

Engineering Contradiction:

Improvecover structure complexityVSAvoidcard accommodation capability

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The cover structure is segmented into multiple functional brackets (first bracket, second bracket, third bracket) that are spatially separated and each equipped with specific accommodation guides. This segmentation allows the cover to accommodate data cards in multiple horizontal directions (first horizontal direction and second horizontal direction perpendicular to the first) while maintaining a relatively simple overall design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cover structure serves multiple functions: it protects the semiconductor substrates from external impacts, accommodates data cards in multiple directions, and provides organized storage spaces. The first and second brackets work together to accommodate cards in the first horizontal direction, while the third bracket with its guides accommodates cards in the second horizontal direction, making the cover universally adaptable to different card insertion orientations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple brackets and guides are added for multi-directional card accommodation, then card storage versatility is improved, but device complexity increases

Engineering Contradiction:

Improvemulti-directional card insertion capabilityVSAvoidnumber of brackets and guides

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Different regions of the cover structure have specialized local qualities tailored to specific card insertion directions. The first and second brackets have accommodation guides configured for the first horizontal direction, while the third bracket has guides for the second horizontal direction. This local differentiation enables multi-directional card accommodation without requiring a completely complex overall structure.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent utilizes spatial arrangement in three-dimensional space to resolve the complexity issue. By positioning brackets at different locations and orientations (spaced apart from each other) and providing guides that extend in different horizontal directions, the structure accommodates cards in multiple dimensions without requiring excessive components in a single plane.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If the cover structure is made more robust for protection, then reliability is improved, but weight and material usage increase

Engineering Contradiction:

Improveprotection capabilityVSAvoidcover weight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The cover structure is designed with protective features built in advance, such as the bracket and guide configurations that inherently provide structural reinforcement. The spaced-apart bracket arrangement and guide extensions create a rigid framework that protects semiconductor substrates from external impacts without requiring additional heavy protective materials.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20260090327A1Cover for module tray and module tray for semiconductor device including the same

Publication Date: 2026.03.26 SAMSUNG ELECTRONICS CO LTD

AI summary

A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.