Module Tray Cover Rib Layout for Warpage Control and Card Insertion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing module tray covers for semiconductor devices are prone to warpage due to their thin thickness, and reinforcement structures to prevent warpage can obstruct the introduction of cards through brackets. Additionally, banding systems used to secure stacked module trays can easily come off or break.
Innovation Solution
A module tray cover with a cover structure that includes a card accommodation portion with separate first and second accommodation spaces, and upper reinforcement structures comprising inclined upper reinforcement ribs to prevent warpage and facilitate card insertion. The cover structure also features a lower reinforcement structure and banding guides to secure the semiconductor device case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If reinforcement structures are added to prevent warpage, then structural stability is improved, but card insertion becomes obstructed
Solution Approach 1:
The reinforcement structure is segmented into multiple ribs (first, second, third reinforcement ribs) that are distributed across the cover. This segmentation allows the reinforcement to provide structural stability while the spaces between ribs allow card insertion, resolving the contradiction between stability and ease of operation.
Solution Approach 2:
The reinforcement ribs are strategically positioned to provide local reinforcement where needed for structural stability, while maintaining open areas where card insertion is required. This local differentiation resolves the contradiction by having different properties in different locations.
2Quantity of substance
If the module tray cover thickness is reduced, then material usage is decreased, but warpage resistance is weakened
Solution Approach 1:
The cover is divided into multiple reinforcement ribs that provide structural support throughout the thin structure. This segmentation allows the use of thin material (reducing quantity) while maintaining warpage resistance through the distributed reinforcement pattern.
Solution Approach 2:
Instead of increasing thickness (one dimension) to prevent warpage, the solution adds reinforcement ribs that extend in another dimension, providing structural support through a different geometric approach that doesn't require additional material thickness.
3Productivity
If multiple module trays are stacked, then storage efficiency is improved, but band security deteriorates
Solution Approach 1:
Banding guides are positioned at specific locations (side surfaces and end surfaces) of the module tray cover. This local positioning at critical points ensures that bands are securely retained during stacking, improving reliability while allowing efficient stacking configurations.
Data Source
AI summary
A module tray cover includes a cover structure configured to cover a module tray that accommodates a plurality of semiconductor devices; a card accommodation portion provided on an upper surface of the cover structure and configured to accommodate a card, the card accommodation portion providing a first accommodation space and a second accommodation space partially overlapped with the first accommodation space; and an upper reinforcement structure including a first plurality of upper reinforcement structures and a second plurality of upper reinforcement structures, the first and second pluralities of upper reinforcement structures being spaced apart from each other in the first and second accommodation spaces, respectively, wherein the first and second pluralities of upper reinforcement structures respectively include first and second pluralities of upper reinforcement ribs sequentially disposed from open side portions of the first and second accommodation spaces.