Semiconductor Module Tray Guide Grooves for Corner Impact Protection
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Solution Overview
Problem
Collisions between semiconductor substrates and the module tray during insertion can cause damage or cracks, particularly at the corner portions of the substrates due to the narrow accommodating space.
Innovation Solution
A module tray design with inclined inner walls and guide grooves that have a concave shape to guide and accommodate semiconductor substrates, minimizing collisions and absorbing impact through inclined end portions and continuous curved surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the accommodating space is made narrow to increase storage density, then the storage capacity is improved, but the risk of collision between semiconductor substrates and the module tray increases
Solution Approach 1:
The patent applies curvature by forming guide grooves with continuous curved surfaces at the corner portions of the accommodating space. These curved guide grooves replace sharp corners with smooth, rounded paths that guide the semiconductor substrates during insertion, preventing direct impact collisions while maintaining the narrow accommodating space configuration for high storage density.
Solution Approach 2:
The patent implements beforehand cushioning by creating guide grooves that extend from the opening toward the bottom surface of the accommodating space. These grooves are positioned to make contact with corner portions of semiconductor substrates before they reach the sharp corners of the cavity, providing a gradual guiding path that cushions the substrate against impact and prevents collision damage in advance.
2Reliability
If guide grooves are added to protect semiconductor substrates, then the protection level is improved, but the device complexity increases
Solution Approach 1:
The patent applies local quality by forming guide grooves only at specific corner portions of the accommodating space where collisions are most likely to occur, rather than modifying the entire accommodating space. This localized approach provides protection exactly where needed while minimizing the addition of structural complexity to the overall module tray design.
Data Source
AI summary
A module tray for a semiconductor device includes a case body defining at least one cavity therein to accommodate a semiconductor substrate on a bottom surface of the cavity. The case body defining first and second inner walls of the at least one cavity extending parallel to each other in a first horizontal direction and having first and second end portions, third and fourth inner walls of the at least one cavity extending parallel to each other in a second horizontal direction orthogonal to the first horizontal direction and having third and fourth end portions, and first to fourth guide grooves of the at least one cavity respectively extending to connect the first to fourth end portions to each other, the first to fourth guide grooves having a concave shape to be spaced apart from corner portions of the semiconductor substrate that is accommodated into the cavity.