Semiconductor Module Tray Fastening Grooves for Substrate Retention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor substrates can come off module trays during manufacturing processes, leading to potential damage and process interruptions.
Innovation Solution
A module tray design with sidewalls and fastening grooves that securely hold semiconductor substrates in place, featuring support portions and grooves that correspond to the substrate's shape to prevent dislodgment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor substrates are held in a simple module tray without fastening structures, then the device complexity is reduced and ease of manufacture is improved, but the substrates may come off during manufacturing processes leading to damage and process interruptions
Solution Approach 1:
The module tray is segmented into multiple functional components: base plate, sidewalls, support portions, and fastening grooves. Each component performs a specific function - the support portions hold the substrate while the fastening grooves secure it, allowing the tray to prevent substrate dislodgment through a structured multi-element design rather than a simple single-structure approach
Solution Approach 2:
The fastening grooves are pre-formed with predetermined shapes that correspond to the substrate side portions before the substrate is placed in the tray. This preliminary preparation of the fastening structure ensures that when the substrate is installed, it is automatically secured by the pre-configured grooves, preventing substrate dislodgment during manufacturing processes
2Reliability
If fastening grooves with predetermined shapes are added to secure substrates, then substrate retention and protection are improved, but the manufacturing complexity and time increase
Solution Approach 1:
The support portions and fastening grooves are merged into a single integrated sidewall structure. The sidewalls simultaneously provide support functions through the support portions and fastening functions through the fastening grooves, combining multiple functions into one component to reduce overall manufacturing complexity while maintaining substrate retention reliability
Solution Approach 2:
The fastening grooves are designed with predetermined shapes that correspond to the substrate side portions, changing the geometric parameters of the groove cross-sections to match specific substrate configurations. This parameter optimization allows the same basic groove structure to adapt to different substrate shapes, improving retention without requiring completely different tray designs for each substrate type
Data Source
AI summary
A module tray for a semiconductor device includes a base plate, and first and second sidewalls extending in a vertical direction on the base plate to define an accommodating space in which a semiconductor substrate is accommodated. The first and second sidewalls include first and second support portions and first and second fastening grooves respectively. The first and second support portions have seating surfaces for supporting a lower surface of the semiconductor substrate in the accommodating space. The first and second fastening grooves respectively extend along the seating surfaces and are configured to temporarily fix the semiconductor substrate through predetermined shapes that correspond to both side portions of the semiconductor substrate.