Electronic Module Via Formation With Joint Recess Filling
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Solution Overview
Problem
Existing electronics module production processes are complex and require specialized materials and processes, such as soldering, which limit flexibility and increase costs.
Innovation Solution
A simplified production procedure for electronics modules that eliminates the need for a carrier substrate with a metallic intermediate layer, allowing for direct electrical connections through a single, jointly filled recess in the primary layer and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a carrier substrate with metallic intermediate layer is used for electrical connections, then electrical connectivity is achieved, but manufacturing complexity increases and specialized soldering materials are required
Solution Approach 1:
The patent removes the metallic intermediate layer from the substrate structure, extracting the complexity of specialized soldering processes and materials. Electrical connections are achieved directly through the primary layer without requiring the intermediate metallic layer that would necessitate complex brazing or soldering operations.
Solution Approach 2:
The primary layer serves multiple functions: it provides both structural support and electrical connectivity. By eliminating the need for a separate metallic intermediate layer, the primary layer becomes a multi-functional component that simplifies both manufacturing and device structure.
2Adaptability or versatility
If specialized soldering materials and processes are used for via formation, then electrical connections are established, but process flexibility is reduced and costs increase
Solution Approach 1:
The patent extracts the requirement for specialized soldering materials and processes by eliminating the metallic intermediate layer. This allows standard encapsulation materials and simpler filling processes to be used, increasing process flexibility and reducing costs.
Solution Approach 2:
The invention changes the material parameters of the primary layer to enable direct electrical connectivity without specialized soldering materials. By modifying the primary layer's properties (e.g., making it conductive or semi-conductive), the process can use standard encapsulation materials rather than specialized soldering compounds.
3Manufacturing precision
If vias are formed during substrate manufacturing process, then substrate integrity is maintained, but process sequence is restricted and quality control is more difficult
Solution Approach 1:
The patent performs via formation as a preliminary action during the encapsulation process rather than during substrate manufacturing. Recesses are created in the encapsulation material before final curing, allowing for better quality control and simpler process sequencing.
Solution Approach 2:
Instead of forming vias through the substrate first and then encapsulating, the patent inverts the sequence by creating recesses in the encapsulation material and then forming the via structure within those recesses. This approach simplifies process control and improves via formation quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity, eliminates the need for specialized soldering materials, and enhances process control, leading to improved quality and reduced failure rates of electronic modules.
Implementation Method 1
forming a via to provide an electrical connection between a second electronic component on an outside of the encapsulation and the metallic intermediate layer, wherein the first recess in the primary layer and the second recess in the encapsulation are jointly filled with an electrically conductive material
Data Source
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AI summary
Method for producing an electronic module (1), comprising: - providing (101) a carrier substrate (10) populated with a first electronic component (30), the carrier substrate (10) having a primary layer (11), a secondary layer (12) and a metal intermediate layer (16) arranged between the primary layer (11) and the secondary layer (12), the primary layer (11) having at least one first cut-out (41); - at least partially encapsulating (102) the populated carrier substrate (10) with an encapsulation (20); - creating a second cut-out (42) in the encapsulation (20); and - forming (103) a via (5) in order to provide an electrical connection between a second electronic component (31) on an exterior (A) of the encapsulation (20) and the metal intermediate layer (16), the first cut-out (41) in the primary layer (16) and the second cut-out (42) in the encapsulation (20) being jointly filled with an electrically conductive material and/or brought into electrical contact with one another in a work step.