Semiconductor Module Weighting for Dynamic Thermal Power Control
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Solution Overview
Problem
Existing semiconductor heat generation control methods fail to dynamically adjust power distribution among modules based on their specific operation rates and usage conditions, leading to inefficient heat management and performance degradation.
Innovation Solution
A semiconductor device that calculates coefficients for each module based on its operation rate and controls power consumption using a PID control mechanism to distribute available power dynamically, considering the usage conditions of multiple modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power consumption is controlled by distributing available power at a fixed ratio among modules, then heat generation can be suppressed, but performance degradation occurs because the distribution does not consider usage conditions of individual modules
Solution Approach 1:
The patent implements dynamic power distribution by continuously monitoring operation rates of individual modules and adjusting power allocation coefficients in real-time based on current usage conditions, rather than using fixed ratios. This allows the system to adapt power distribution to actual operational needs, suppressing heat generation when modules are underutilized while maintaining performance when they are actively used.
Solution Approach 2:
The system employs feedback mechanisms by detecting operation rates of each module and using this information to dynamically adjust power distribution coefficients. The control unit continuously monitors module performance and heat generation, then modifies power allocation accordingly, creating a closed-loop control system that balances thermal management with performance optimization.
2Productivity
If the operation rate of a specific module is increased to meet performance demands, then productivity is improved, but heat generation increases beyond acceptable levels
Solution Approach 1:
The patent changes the parameter of power distribution coefficients dynamically based on operation rates. When a module's operation rate increases, the system adjusts its power distribution coefficient to optimize the balance between delivering sufficient power for high performance and limiting heat generation, thereby managing thermal conditions while meeting productivity demands.
3Device complexity
If power is supplied to each device at a fixed ratio to simplify control, then device complexity is reduced, but adaptability to different usage conditions deteriorates
Solution Approach 1:
The patent transforms fixed power distribution into a dynamic system where coefficients are continuously adjusted based on detected operation rates. This dynamic approach enables the control system to adapt to various usage conditions and module states while maintaining manageable complexity through automated detection and adjustment mechanisms.
Solution Approach 2:
The system implements self-service control by automatically detecting operation rates and adjusting power distribution coefficients without requiring external intervention or complex manual configuration. Each module's usage conditions are monitored and responded to autonomously, enhancing adaptability while keeping the control mechanism relatively simple.
Data Source
AI summary
A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.