MOEMS Optical Component Rear-Side PCB Lateral Contacts
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Solution Overview
Problem
Existing optical components with multi-mirror arrangements as micro-opto-electro-mechanical systems (MOEMS) face challenges in dense packaging and efficient electrical and thermal management, leading to complex assembly and reduced mechanical stability.
Innovation Solution
An optical component design featuring a MOEMS with a printed circuit board on the rear side, sealed in a vacuum-tight cavity, utilizing lateral contacts for electrical and thermal management, allowing for dense packaging and improved mechanical stability through secure connection and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board is arranged on the rear side of the MOEMS, then electrical contacting is improved, but the packaging density is reduced due to increased component footprint
Solution Approach 1:
The patent transitions from traditional top-side PCB mounting to rear-side PCB arrangement on the MOEMS, utilizing the third dimension (depth/thickness) to resolve the spatial conflict. This allows electrical contacts to be established from the rear side while maintaining a compact overall footprint, effectively packing components more densely in the planar dimensions.
2Ease of manufacture
If lateral contacts are used for electrical contacting, then assembly is simplified, but thermal management capability is reduced
Solution Approach 1:
The lateral contacts are designed to serve dual functions: electrical contacting and thermal conduction. By making the contacts multi-functional, the patent eliminates the trade-off between assembly simplicity and thermal management, as the same structural elements perform both electrical and thermal roles simultaneously.
3Area of stationary object
If the printed circuit board has a smaller cross section than the MOEMS, then dense packaging is enabled, but electrical contact reliability is reduced
Solution Approach 1:
The patent divides the electrical contact function into multiple lateral contact points distributed around the perimeter of the printed circuit board. This segmentation allows the total contact area to be sufficient for reliable electrical connection while keeping the board's cross-sectional area small for dense packaging.
4Productivity
If multiple MOEMS are arranged next to each other to form a tessellation, then productivity is improved, but mechanical stability is reduced due to complex assembly
Solution Approach 1:
The patent merges multiple MOEMS units with their respective printed circuit boards into a unified tessellating structure where adjacent units share common boundaries and contact points. This merging approach enables scalable assembly while maintaining mechanical stability through the interconnected nature of the tiled arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient electrical contacting and thermal management, enhancing the mechanical stability and assembly of optical components, facilitating the production of microstructured or nanostructured components in projection exposure apparatuses.
Implementation Method 1
a cavity sealed in a vacuum-tight manner
Implementation Method 2
The lateral contacts can also be used for thermal conduction, in particular for dissipating heat from the optical component
Data Source
AI summary
An optical component includes at least one micro-opto-electro-mechanical system (MOEMS) with a front side and a rear side. The optical component also includes at least one printed circuit board arranged on the rear side of the at least one MOEMS. The at least one printed circuit board has lateral contacts. The at least one printed circuit board may be equipped with electronic parts and cooling elements. The at least one MOEMS projects laterally beyond the at least one printed circuit board.