MoNb Oxide Adhesive Layer for ITO-Metal Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The bonding force between indium tin oxide (ITO) and metal layers in electrode structures for touch screens deteriorates when the linewidth of the pattern narrows, leading to issues like poor display and touch sensitivity due to peeling-off of the metal layer during dry and wet etching processes.
Innovation Solution
Incorporating a molybdenum niobium (MoNb) oxide adhesive layer between the ITO and metal layers, with an aluminum neodymium (AlNd) alloy metal layer and MoNb alloy protection layers, to enhance adhesion and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the linewidth of the pattern is narrowed to improve display quality and reduce bezel width, then the visual appearance is improved, but the bonding force between the ITO layer and metal layer deteriorates, causing peeling-off during etching
Solution Approach 1:
An aluminum oxide adhesive layer is introduced as an intermediary between the ITO layer and the metal layer. This adhesive layer specifically addresses the bonding force deterioration that occurs when linewidth is narrowed, preventing peeling-off during etching while allowing the narrow linewidth design to be maintained.
Solution Approach 2:
The electrode structure uses a composite material approach by combining ITO layer, aluminum oxide adhesive layer, and metal layer into a multi-layer composite structure. This composite structure resolves the contradiction by allowing each layer to perform its specific function: ITO for conductivity and transparency, aluminum oxide for adhesion, and metal for enhanced conductivity.
2Reliability
If the metal layer thickness is increased to improve conductivity, then the conductive performance is improved, but the manufacturing complexity and material consumption increase
Solution Approach 1:
The patent employs a composite material structure with multiple thin layers (ITO layer, aluminum oxide adhesive layer, and metal layer) that together achieve superior conductive performance. This composite approach allows optimization of each layer's thickness and material properties, improving overall conductivity while controlling manufacturing complexity through standardized thin-film deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MoNb oxide adhesive layer improves the bonding force between the ITO and metal layers, preventing peeling and maintaining touch sensitivity and display quality even at narrower linewidths.
Implementation Method 1
a metal oxide adhesive layer disposed between the ITO layer and the metal layer
Implementation Method 2
a metal layer 30 is disposed by a sputtering film-forming process on an ITO layer 20
Data Source
AI summary
The present disclosure: discloses an electrode structure, and the electrode structure may include: a substrate, an indium tin oxide (ITO) layer, and a metal layer that are stacked sequentially; and a metal oxide adhesive layer disposed between the ITO layer and the metal layer. The present disclosure further discloses a method for manufacturing an electrode structure, which may include: providing a substrate; disposing an indium tin oxide (ITO) layer on the substrate; disposing a metal oxide adhesive layer on the ITO layer; and disposing a metal layer on the metal oxide adhesive layer. In this way, the present disclosure may improve the bonding force between the ITO layer and the metal layer of the electrode structure.