Moiré Mark Alignment for Imprint Positioning Accuracy
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Solution Overview
Problem
The existing imprint methods face challenges in achieving high positional accuracy due to the limited flexibility and precision in positioning between the template and the processing object, primarily because the alignment marks have predetermined shapes and are arranged in Kerf regions, limiting their arrangement flexibility and accuracy.
Innovation Solution
The implementation of a moire mark system, which includes a combination of alignment marks on the template and the processing object with different structural periods, generates a moire image for precise positioning, allowing for higher accuracy and flexibility by using a combination of first and second structure moire marks with specific period differences and sizes to absorb initial errors and maintain high positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment marks are arranged in Kerf regions with predetermined shapes, then the positioning process can be performed, but the arrangement flexibility and positioning accuracy are limited
Solution Approach 1:
The patent changes the fundamental parameters of alignment marks by introducing moire marks with varying periods (first period and second period different from the first) and different structures (first structure and second structure), replacing the conventional single-period alignment marks. This enables flexible arrangement in various regions (shot regions, Kerf regions, common regions) while achieving high positioning accuracy through moire image generation.
Solution Approach 2:
The alignment mark system is segmented into multiple types: moire marks with different periods (first period, second period), different structures (first structure, second structure), and different arrangements (overlapping, non-overlapping). This segmentation allows selective use of appropriate mark types in different regions, improving both arrangement flexibility and positioning accuracy.
2Manufacturing precision
If conventional alignment marks are used, then the positioning process can be completed, but high positional accuracy cannot be achieved
Solution Approach 1:
The patent introduces moire images as an intermediary mechanism between the template and processing object matter. By generating moire images through overlapping alignment marks with different periods, the system achieves high positional accuracy without requiring complex positioning equipment or procedures. The moire image serves as a visual mediator that amplifies positioning information.
Solution Approach 2:
The patent replaces complex mechanical positioning systems with an optical measurement system based on moire image generation. Instead of relying on mechanical precision of alignment mechanisms, the system uses optical interference patterns (moire images) to achieve high positional accuracy, substituting mechanical complexity with optical simplicity.
3Measurement precision
If alignment marks are made larger to improve detection, then positioning accuracy may improve, but the area required increases
Solution Approach 1:
The patent transitions from detecting alignment in a single spatial dimension to utilizing the temporal dimension of moire image generation. By overlapping alignment marks with different periods to create moire images, the system achieves enhanced detection precision without increasing the physical area, as the precision gain comes from the interference pattern rather than mark size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the positional accuracy and flexibility of the imprint process, enabling precise alignment and pattern transfer while reducing the area required for the moire marks, thus improving the overall efficiency and accuracy of the imprint method.
Implementation Method 1
a monitor which optically monitors a state where the first alignment mark and the second alignment mark are overlaid with each other
Implementation Method 2
The first alignment mark includes a first template-side mark and a second template-side mark. The first template-side mark includes a first pattern in which a plurality of first portions are arranged with a first period in the first direction. The second template-side mark includes a second pattern in which a plurality of second portions are arranged with a second period in the first direction.
Data Source
AI summary
According to an embodiment, a first alignment mark includes a first template-side mark in which a plurality of first portions are arranged with a first period, and a second template-side mark in which a plurality of second portions are arranged with a second period. A second alignment mark includes a first wafer-side mark in which a plurality of third portions are arranged with a third period, and a second wafer-side mark in which a plurality of fourth portions are arranged with a fourth period. The first wafer-side mark and the first template-side mark are configured to be overlaid with each other to constitute a first moire mark. The second wafer-side mark and the second template-side mark are configured to be overlaid with each other to constitute a second moire mark. An average period of the first moire mark and an average period of the second moire mark are different from each other.