Moisture-Blocking Adhesive Composition for Organic Electronic Device Encapsulation
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Solution Overview
Problem
Organic electronic devices (OEDs) are vulnerable to external factors such as moisture, leading to delamination and oxidation of organic materials, which deteriorate their performance and lifespan, and existing encapsulation methods are inadequate in preventing moisture penetration.
Innovation Solution
A curable adhesive composition comprising a solid or semi-solid resin, a moisture absorbent, and a filler, which forms a crosslinked structure to effectively encapsulate OEDs, preventing moisture and humidity ingress while maintaining adhesive properties and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulation structures (metal can or glass can with moisture absorbent) are used, then moisture protection is provided, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the encapsulation function and moisture absorption function into a single adhesive composition. The adhesive resin forms the encapsulation layer while the moisture absorbent particles are dispersed within the adhesive matrix, eliminating the need for separate metal/glass cans and getter materials. This merging reduces structural complexity while maintaining moisture protection.
Solution Approach 2:
The invention uses a composite adhesive material consisting of adhesive resin and moisture absorbent particles. This composite formulation integrates multiple functions (encapsulation, moisture absorption, adhesion) into one material system, simplifying the overall device structure compared to conventional separate components.
2Reliability
If conventional encapsulation structures are used, then moisture protection is provided, but manufacturing process complexity increases
Solution Approach 1:
By merging encapsulation and moisture absorption functions into a single adhesive composition, the manufacturing process is simplified. The adhesive can be applied directly to the OLED in a single step, eliminating the complex multi-step process of installing separate metal/glass cans and getter materials required by conventional methods.
Solution Approach 2:
The adhesive composition is self-contained with the moisture absorbent particles already dispersed within the adhesive matrix. This self-service formulation eliminates the need for separate installation steps for moisture protectors, allowing the encapsulation to be achieved through a single application and curing process.
3Reliability
If adhesive composition with moisture absorbent is used, then moisture blocking is improved, but adhesive resin viscosity must be controlled to prevent bubble mixing
Solution Approach 1:
The patent specifies controlling the viscosity of the adhesive resin within a particular range (10^6 to 10^9 cP at room temperature) to optimize both moisture blocking performance and processability. This parameter control prevents bubble formation during application while maintaining the moisture absorbent particles dispersed within the adhesive matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition provides excellent moisture blocking, adhesive, and impact resistance, enhancing the lifespan and durability of OEDs by forming a reliable encapsulation layer that maintains device performance and stability.
Implementation Method 1
The adhesive composition includes a curable adhesive resin, a moisture absorbent, and a filler
Implementation Method 2
The curable adhesive resin is in a solid or semi-solid phase at room temperature, and preferably, may be in a solid phase
Data Source
Figure 1~3
AI summary
The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.