Moisture resistance improver for water-based adhesive for inorganic materials, and water-based adhesive for inorganic materials
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional water-based binders for inorganic materials, such as phenol resin, release formaldehyde and have insufficient adhesiveness, while alternative binders proposed in prior art do not adequately address the need for superior adhesiveness and moisture resistance in inorganic fiber laminates.
Innovation Solution
A moisture resistance improver comprising specific copolymers with unsaturated (poly)carboxylic acid anhydrides and (meth)acrylic acid esters, which enhance the adhesiveness and moisture resistance of water-based adhesives for inorganic materials, particularly inorganic fiber laminates, without using formaldehyde.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If phenol resin is used as a water-based binder for inorganic materials, then adhesiveness is improved, but formaldehyde is released into the environment
Solution Approach 1:
The patent extracts and removes the harmful formaldehyde component from the binder system by replacing phenol resin with a formaldehyde-free alternative comprising oligomer/co-oligomer and polyol, thereby eliminating formaldehyde release while maintaining binding functionality
Solution Approach 2:
The patent changes the chemical composition parameters of the binder by specifying particular molecular weight ranges (number-average molecular weight of 300-900 for oligomer, specific polyol ratios) to achieve both formaldehyde-free formulation and adequate adhesiveness
2Object-generated harmful factors
If formaldehyde-free binder comprising oligomer and polyol is used, then formaldehyde release is eliminated, but adhesiveness becomes insufficient
Solution Approach 1:
The patent optimizes the molecular weight parameters (number-average molecular weight of 300-900 for oligomer/co-oligomer) and compositional ratios (polyol content of 10-60 parts per 100 parts oligomer) to maximize adhesiveness while maintaining formaldehyde-free formulation
Solution Approach 2:
The patent creates a composite binder system combining oligomer/co-oligomer with polyol in specific proportions, where the synergistic interaction between these components provides both formaldehyde-free operation and sufficient adhesiveness for inorganic materials
3Ease of operation
If conventional water-based binder is used, then ease of application is maintained, but moisture resistance of adhered product is insufficient
Solution Approach 1:
The patent modifies the chemical structure parameters of the binder by selecting oligomers with specific functional groups and molecular weights (300-900) that provide both water-based applicability and enhanced moisture resistance in the cured adhered product
Solution Approach 2:
The patent introduces polyol as an intermediary component that bridges the water-based oligomer and the inorganic material substrate, providing both ease of application through water solubility and moisture resistance through the polyol's hydrophobic characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution imparts superior adhesiveness, moisture resistance, and rigidity to adhered products of inorganic materials, particularly inorganic fiber laminates, while avoiding the use of formaldehyde, thus providing a more effective and environmentally friendly adhesive system.
Implementation Method 1
a (co)polymer comprising an unsaturated (poly)carboxylic acid (anhydride) (a1) having 3 to 30 carbon atoms and a (meth)acrylic acid ester (a2) having a solubility at 25° C. of 10 g or less per 100 g of water as constituent monomers
Data Source
AI summary
Provided are a moisture resistance improver that yields a water-based adhesive for inorganic materials having exceptional adhesiveness of inorganic materials, and a water-based adhesive for inorganic materials in which the moisture resistance improver is used. The present invention is a moisture resistance improver (J) for a water-based adhesive for inorganic materials containing at least one (co)polymer (A) selected from the group consisting of (co)polymer (A1) and (co)polymer (A2). (Co)polymer (A1): a (co)polymer having a weight-average molecular weight of 3,000-150,000, and containing, as structural monomers, a C3-30 unsaturated (poly)carboxylic acid (anhydride) (a1) and a (meth)acrylic acid ester (a2) having solubility of 10 g or less per 100 g of water at 25° C. (Co)polymer (A2): a (co)polymer having a weight-average molecular weight of 6,000-150,000, and containing the above unsaturated (poly)carboxylic acid (anhydride) (a1) as a structural monomer but not containing the above (meth)acrylic acid ester (a2) as a structural monomer.