Mold Assembly for Waterproof Electrical Connectors
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Solution Overview
Problem
Existing methods for molding electrical components for underwater applications often result in components with increased air voids, longer cure times, and brittleness, which can lead to electrical shorting or failure due to water contact.
Innovation Solution
The use of Chockfast Orange epoxy resin, preheated and mixed with a hardener at specific ratios, is injected into a preheated mold assembly under controlled pressure, allowing for a shorter cure time and reduced brittleness, with a mold design accommodating wires and featuring a locator plate for precise pin alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If injection molding is used to manufacture electrical components, then the components can be produced with controlled material flow, but the resin viscosity increases during injection leading to increased air voids and longer cure times
Solution Approach 1:
The patent applies parameter changes by preheating the resin composition to a temperature between 100°F and 150°F before injection, and preheating the mold assembly to between 75°F and 125°F. This temperature control modifies the resin's viscosity characteristics during injection, allowing for complete mold filling while minimizing air void formation and reducing cure time to less than 24 hours.
2Ease of manufacture
If injection molding is used to manufacture electrical components, then the components can be produced with controlled material flow, but the cure time increases to approximately 24 hours
Solution Approach 1:
The patent applies preliminary action by preheating the resin composition before injection and preheating the mold assembly in advance. This preparatory heating ensures that the resin maintains optimal flow characteristics during injection and that the mold is ready to receive the resin, enabling complete curing in less than 24 hours while maintaining controlled material flow.
3Ease of manufacture
If injection molding is used to manufacture electrical components, then the components can be produced with controlled material flow, but the components become brittle and prone to failure
Solution Approach 1:
The patent applies parameter changes by controlling the temperature of both the resin composition (100°F-150°F) and the mold assembly (75°F-125°F) during injection molding. This temperature control prevents excessive resin viscosity changes that cause brittleness, resulting in electrical components with improved strength and reduced susceptibility to failure while maintaining controlled material flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of waterproof, durable electrical connectors with a faster cure time, reducing the likelihood of failure and enabling higher production efficiency for underwater applications.
Implementation Method 1
preheating a resin composition for up to 30 minutes at a temperature between 100° F. and 150° F.
Implementation Method 2
preheating a mold assembly to a temperature between 75° F. and 125° F. for at least 30 minutes
Implementation Method 3
curing the mixture for less than 24 hours
Data Source
AI summary
A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.