One-Piece Mold Base With Integrated Heat Exchange Cavity

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Solution Overview

Problem

Current mold designs for blow molding and stretch blow molding face challenges in achieving homogeneous heat exchange, energy efficiency, and manufacturing complexity, particularly in the mold base where complex shapes and limited volume hinder effective thermal regulation and lead to issues like non-uniform cooling/heating and seal integrity.

Innovation Solution

A one-piece mold base with an integrated cavity that matches the relief of the molding surface, featuring a thin, uniform molding wall and a secondary wall, along with a distribution chamber and manifold system for fluid circulation, optimized for efficient heat transfer and simplified manufacturing through direct additive laser construction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional fluidic circuits are machined into the mold base, then heat exchange capability is improved, but manufacturing complexity and sealing requirements increase

Engineering Contradiction:
Improveheat exchange capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the fluidic circuit directly into the mold base structure itself, eliminating the need for separate machined channels and external piping. The mold base acts as both the structural component and the heat exchange medium container, reducing manufacturing steps and sealing interfaces.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mold base serves multiple functions simultaneously: it provides structural support, defines the molding cavity, and acts as a heat exchange component. This multi-functionality reduces the number of separate components needed and simplifies the overall manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If fluidic circuits are positioned close to the molding surface, then heat exchange efficiency is improved, but seal integrity at interfaces deteriorates

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidseal integrity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

By integrating the fluidic circuit into the mold base structure rather than positioning it as a separate component, the patent eliminates the interface between the circuit and the mold base. This removes the sealing problem entirely while maintaining close proximity to the molding surface for efficient heat exchange.

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If complex fluidic circuits are added to maximize exchange surfaces, then heat exchange effectiveness is improved, but consumption of heat transfer fluid increases

Engineering Contradiction:
Improveheat exchange effectivenessVSAvoidheat transfer fluid consumption
Core Design Contradiction:
TemperatureVSQuantity of substance

Solution Approach 1:

The patent positions the fluidic circuit locally within the mold base structure, concentrating heat exchange capability where it is most needed. This localized approach provides effective heat exchange without requiring extensive fluid circulation throughout the entire system.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The integration of the fluidic circuit into the mold base creates a compact system with reduced fluid volume requirements. The merged structure allows for efficient heat transfer with minimal heat transfer fluid consumption compared to traditional external circuit designs.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If traditional machining techniques are used for fluidic circuits, then manufacturing flexibility is maintained, but manufacturing time and material loss increase

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidmanufacturing time
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces traditional mechanical machining processes with additive manufacturing technology. This substitution enables the creation of complex fluidic circuit geometries within the mold base without extensive material removal, reducing both manufacturing time and material waste while maintaining design flexibility.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat exchange homogeneity, reduces energy consumption, improves seal integrity, and simplifies the manufacturing process, leading to improved container quality and reduced production time.

Implementation Method 1

the optimization of the heat exchange between the material of the container and the heat transfer fluid circulating in the cavity

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

by direct additive laser construction

Methodology Applied
Scientific EffectLaser melting: Laser

Data Source

PatentEP3083190B1Moulding device including a one-piece mould bottom including a heat-exchange cavity matching a moulding surface
Publication Date: 2020.07.01 SIDEL PARTICIPATIONS SAS
  • EP3083190B1 patent drawingFigure 1
  • EP3083190B1 patent drawingFigure 2~3
  • EP3083190B1 patent drawingFigure 4

AI summary

The invention relates to a one-piece mould bottom (7) for a mould (1) for manufacturing containers, said mould bottom (7) including a moulding wall (8) having a raised moulding surface (9) bearing the imprint of at least one portion of a container bottom. Said mould bottom (7) includes a cavity (27) integrally formed with the mould bottom (7), defined by a surface casing (29) defined entirely by the mould bottom (7) and including an inner surface (31) of the moulding wall (8), opposite the moulding surface (9) and matching the raised pattern thereof, and a rear surface (32, 33) opposite the inner surface (31). The mould bottom (7) is provided with at least one pair of openings (35; 37) leading into the cavity (27) for circulating a heat-transfer fluid inside the cavity.