Injection Mold Bus Transceiver Wiring Complexity

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Solution Overview

Problem

Injection molding systems face complexity in wiring due to the need for numerous independent conductive wires connecting sensors, actuators, and controllers, leading to increased wiring complexity and reduced efficiency.

Innovation Solution

Implementing a bus transceiver and controller system where electrical devices within the mold are connected via a bus line, allowing for reduced wiring complexity by using nodes to manage data and power transmission over shared bus lines, enabling efficient communication and control of heaters and temperature sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If independent conductive wires are used to connect each sensor and actuator to the controller, then reliable communication is achieved, but wiring complexity increases significantly

Engineering Contradiction:
Improvecommunication reliabilityVSAvoidwiring complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple independent communication channels are merged into a single shared bus line. The patent implements a serial communication bus where multiple nodes (sensors, actuators, controllers) share a common communication medium, eliminating the need for separate point-to-point wiring between each component pair.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared bus line serves multiple functions simultaneously - it carries data between multiple different nodes, provides power to remote devices, and enables both sensing and actuation operations through the same infrastructure, replacing multiple specialized wiring systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If a shared bus line is used to connect multiple electrical devices, then wiring complexity is reduced, but data transmission reliability may be affected

Engineering Contradiction:
Improvewiring complexityVSAvoiddata transmission reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The serial communication protocol implements acknowledgment and error-checking mechanisms where receiving nodes send feedback signals to transmitting nodes, confirming successful data reception or requesting retransmission, thereby maintaining reliability on the shared bus.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

A master controller acts as an intermediary that manages bus access, coordinates communication between nodes, and handles error correction, ensuring reliable data transmission despite the shared medium's potential for conflicts or interference.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If numerous independent wires are used for each electrical device, then individual device control is precise, but installation time and labor increase

Engineering Contradiction:
Improveinstallation easeVSAvoidinstallation time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

Multiple separate wiring operations are merged into a single bus installation process. Instead of running individual cables from the controller to each sensor and actuator, a single bus backbone is installed with simple daisy-chain connections to each node, dramatically reducing installation time and labor.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If multiple independent conductive wires are used to connect electrical devices in the mold, then precise control of each component is achieved, but the amount of wiring material increases

Engineering Contradiction:
Improvecomponent control precisionVSAvoidwiring material
Core Design Contradiction:
Ease of operationVSLoss of substance

Solution Approach 1:

Multiple separate wire runs are merged into a single shared bus infrastructure. The patent shows how a single pair of conductors can carry addressed signals to multiple different devices, replacing what would otherwise require dozens of individual wire connections while maintaining full control precision.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7824163B2Injection molding system having a bus
Publication Date: 2010.11.02 MOLD MASTERS (2007) LIMITED
  • US7824163B2 patent drawing
  • US7824163B2 patent drawing
  • US7824163B2 patent drawing

AI summary

An injection molding system includes a mold having a hot half and a cold half, the hot half including a hot runner. A bus transceiver is located in the mold. At least one electrical device associated with the operation of the mold is located in the mold and electrically coupled to the bus transceiver. A controller for controlling the mold is located outside the mold. A bus line electrically couples the controller to the bus transceiver of the electrical device apparatus includes an injection manifold having an inlet and a melt channel.