Mold Cavity Pressure and Temperature Sensing Device
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Solution Overview
Problem
Current injection molding technologies face challenges in real-time monitoring of in-mold pressure and temperature, leading to inefficiencies in process parameter adjustments, high costs for small batch production, and delayed quality assessment, due to indirect measurement methods and lack of integration in existing mold sensing technologies.
Innovation Solution
A sensing device is designed to directly measure in-mold pressure and temperature by integrating a strain gage and temperature-sensing element within a strain structure, which transforms pressure and temperature data into deformation and temperature information, processed in real-time to estimate actual mold cavity pressure values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If indirect measurement mode using ejector pin with strain sensor is used, then pressure can be measured, but measurement precision is reduced due to distortion and the sensing element cannot be positioned at the optimal location
Solution Approach 1:
The patent combines the pressure sensing function and temperature sensing function into a single integrated sensing device that is directly installed in the mold cavity. This merging eliminates the need for separate ejector pin-based pressure sensors and temperature sensors, reducing overall system complexity while improving measurement precision through direct contact with the mold cavity environment.
Solution Approach 2:
The patent introduces a diaphragm as an intermediary element that directly contacts the mold cavity to sense pressure and transmits this information to the sensing elements. This diaphragm-based intermediary approach allows for more accurate pressure measurement compared to the ejector pin method, as it provides a direct measurement interface without the mechanical complexity and potential distortion issues of the pin structure.
2Adaptability or versatility
If separate sensing devices are used for pressure and temperature, then each parameter can be measured, but device complexity increases and integration in mold is difficult
Solution Approach 1:
The patent merges pressure sensing and temperature sensing into a single integrated device structure. The sensing device includes both a strain gauge for pressure measurement and a temperature sensor, both housed within the same mold cavity installation interface. This consolidation reduces the number of separate components needed and simplifies the overall sensing system while maintaining the ability to measure both parameters simultaneously.
Solution Approach 2:
The sensing device is designed with multi-functionality, serving both pressure measurement and temperature measurement purposes through a single integrated structure. The device includes a diaphragm for pressure sensing, strain gauges for transducing the pressure information, and a temperature sensor, all within one universal sensing unit that can be installed in the mold cavity to perform multiple sensing functions.
3Productivity
If indirect measurement methods are used, then equipment can be simpler, but real-time monitoring capability is reduced and quality assessment is delayed
Solution Approach 1:
The patent implements preliminary action by installing the sensing device directly in the mold cavity before the injection molding process begins. This allows for real-time monitoring of pressure and temperature parameters throughout the molding process, enabling immediate detection of any deviations or quality issues rather than waiting for post-production inspection. The sensing device is positioned to directly contact the molded part as it forms, ensuring continuous real-time data acquisition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring of pressure and temperature changes within the mold cavity, improving the determination of finished product quality and equipment functionality, reducing system complexity and enhancing the integration of mold sensing technologies.
Implementation Method 1
at least one strain gage, disposed on the strain structure and configured to measure the deformation amount of the strain structure and transform the deformation amount into deformation amount information
Implementation Method 2
at least one temperature-sensing element, disposed in the strut and configured to measure a real-time temperature of the strut and transform the temperature into strut temperature information
Data Source
AI summary
A sensing device of pressure and temperature in a mold comprises: a housing communicating with a mold cavity, and including a channel and an accommodating space; a base on a bottom surface of the housing, and including a mesa on a top; a strut in the accommodating space, and a front end thereof extended into the channel and exposed to the mold cavity; a strain structure between the mesa and a back end of the strut, and located on the mesa; a strain gage on the strain structure to measure a deformation amount of the strain structure the mold cavity and transforming the deformation amount into deformation amount information; a temperature-sensing element in the strut to measure a temperature of the strut, and transforming the temperature into strut temperature information; and a processing unit to obtain the deformation amount information and the strut temperature information.