Mold Chase for Integrated Circuit Package Assembly
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Solution Overview
Problem
Current package-on-package (POP) assemblies with interposers increase dimensionality, and laser drilling for via formation is costly and prone to solder bridging issues due to conical via profiles, especially in high-density interconnect structures.
Innovation Solution
A mold chase system that deposits mold material and forms precise cylindrical vias simultaneously, using pins to protect interconnect structures and prevent mold material deposition, thereby reducing the likelihood of solder bridging and eliminating the need for additional laser drilling steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an interposer is used to facilitate routing of electrical signals between dies, then signal routing capability is improved, but assembly dimension (Z-direction) increases
Solution Approach 1:
The patent removes the interposer from the POP assembly structure entirely. Instead of using a separate interposer substrate for signal routing, the invention routes signals directly through the mold compound using vias that pass through the mold material between package substrates, thereby eliminating the Z-direction dimension increase caused by interposers while maintaining signal routing capability
Solution Approach 2:
The patent combines the mold compound deposition process with the via formation process into a single integrated operation. The mold chase simultaneously deposits mold material and forms vias through the mold compound in one step, eliminating the need for separate laser drilling operations and reducing manufacturing complexity
2Ease of manufacture
If laser drilling is used to form vias through mold material, then via formation is achieved, but manufacturing cost increases due to extensive time and additional equipment
Solution Approach 1:
The patent merges the mold compound deposition process with the via formation process into a single integrated operation using a mold chase. The mold chase simultaneously deposits mold material and forms vias through the mold compound in one step, eliminating the need for separate laser drilling operations and reducing manufacturing complexity
Solution Approach 2:
The patent replaces the laser drilling process with a mechanical forming process using a mold chase. Instead of using laser energy to ablate and form vias, the invention uses mechanical pins within the mold chase to form vias during the mold compound deposition process, eliminating the need for expensive laser drilling equipment and reducing manufacturing time
3Ease of manufacture
If laser drilling is used to form vias, then via formation is achieved, but solder bridging risk increases due to conical via profiles with sloped sidewalls
Solution Approach 1:
The patent replaces the laser drilling process with a mechanical forming process using a mold chase. Instead of using laser energy to ablate and form vias, the invention uses mechanical pins within the mold chase to form vias during the mold compound deposition process, producing cylindrical vias with uniform sidewalls that prevent solder bridging
Solution Approach 2:
The patent changes the via profile geometry from conical (sloped sidewalls) to cylindrical (uniform sidewalls). The mold chase pins maintain a constant diameter throughout the via depth, creating uniform sidewalls that prevent solder material from bridging between adjacent vias during the soldering process, thereby improving reliability
4Volume of moving object
If interconnect structures increase in density with smaller pitch, then form factor is reduced, but solder bridging likelihood in laser-drilled vias increases
Solution Approach 1:
The patent changes the via profile geometry from conical to cylindrical, creating uniform sidewalls that maintain consistent spacing between adjacent vias. This cylindrical profile with uniform diameter throughout the via depth prevents solder material from bridging between closely-spaced interconnect structures, enabling higher density interconnect arrangements while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mold chase system reduces assembly dimensions, minimizes solder bridging, and integrates via formation into the mold deposition process, enhancing the reliability and efficiency of POP assemblies by maintaining consistent via profiles and reducing operational costs.
Implementation Method 1
The mold material may be deposited on a package substrate and, subsequently, a laser drilling process may be used to form vias through the mold material
Data Source
AI summary
Embodiments of the present disclosure are directed towards a mold chase for integrated circuit package assembly and associated techniques and configurations. In one embodiment, a method includes receiving a package substrate, the package substrate including a first die mounted on the package substrate by a plurality of first interconnect structures, and a plurality of second interconnect structures disposed on the package substrate and to route electrical signals of a second die, protecting a top surface of individual interconnect structures of the plurality of second interconnect structures from deposition of a mold material, and depositing the mold material on the package substrate between the individual interconnect structures of the plurality of second interconnect structures. Other embodiments may be described and/or claimed.