Mold Chase Trench Formation for Semiconductor Shielding
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Solution Overview
Problem
Conventional semiconductor package-level shielding processes require multiple manufacturing steps, including cutting trenches in the molding material, which is inefficient and complex.
Innovation Solution
A mold chase with a protrusion forms a trench during molding, allowing a conductive material to be deposited as a compartmental shield between components, eliminating the need for additional cutting steps and integrating a conformal shield for enhanced protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-step shielding processes are used, then component isolation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple shielding process steps into a single integrated molding operation. The mold chase includes integrated features (cavities, protrusions, conformal surfaces) that simultaneously create compartmental shields and conformal shields during one molding cycle, eliminating the need for separate cutting, shielding material deposition, and conformal shielding steps that characterize conventional processes.
Solution Approach 2:
The mold chase is pre-configured with specific geometric features (cavities, protrusions, conformal surfaces) before the molding process begins. These pre-integrated features guide the molding material to automatically form the desired shield geometries and compartments during the molding operation, eliminating the need for subsequent post-processing steps to create shielding structures.
2Reliability
If multiple manufacturing steps are used for shielding, then shield integration is achieved, but productivity decreases
Solution Approach 1:
The patent merges shield integration with the primary molding operation into a single simultaneous process. The molding material is deposited to form both the package structure and the shielding compartments/conformal shields in one continuous operation, eliminating multiple sequential steps required in conventional processes and thereby significantly improving manufacturing throughput and productivity.
Solution Approach 2:
The mold chase is pre-designed with integrated shielding features that enable the molding material to self-form the shielding structures during deposition. This preliminary configuration of the mold chase allows shield integration to occur automatically during the molding process without requiring subsequent separate integration steps, thereby enhancing manufacturing efficiency.
3Reliability
If trenches are cut in molding material, then compartmental shielding is achieved, but manufacturing complexity increases
Solution Approach 1:
Instead of cutting trenches into solid molding material after molding to create compartments, the patent inverts the approach by designing the mold chase with cavities and protrusions that directly form the compartmental shields during the molding process itself. The molding material is deposited around these pre-formed mold features, automatically creating the desired compartmental geometry without requiring subsequent cutting or machining operations.
Solution Approach 2:
The mold chase is pre-configured with cavities, protrusions, and conformal surfaces that define the geometry of the compartmental shields before molding begins. This preliminary configuration ensures that when the molding material is deposited, the compartmental shield structures are automatically formed as integral parts of the package, eliminating the need for post-molding trench cutting and shield fabrication steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the shielding process, reduces manufacturing complexity, and effectively isolates components within a multifunctional package by forming a compartmental shield during the molding process, enhancing protection against electromagnetic interference and physical interactions.
Implementation Method 1
A mold chase with a protrusion forms a trench during molding, allowing a conductive material to be deposited as a compartmental shield between components
Implementation Method 2
allowing a conductive material to be deposited as a compartmental shield between components
Implementation Method 3
one or more conductive shields are integrated within the protective covering to isolate components and compartmentalize the SiP
Data Source
AI summary
A mold chase for packaging a compartmentally shielded multifunctional semiconductor is provided. The mold chase generally includes a first cavity and a second cavity separated by a trench plate positioned between a first component and a second component of the multifunctional semiconductor between which a compartmental shield is required. The mold chase is lowered into a molding position over the multifunctional semiconductor and a molding material is injected through an inlet sprue into the first and second cavities to surround the first and second components, respectively. After the molding material is cured, the mold chase is removed and an open trench is formed in the cured molding material by the trench plate. The open trench is filled with a conductive material to form the compartmental shield. A conformal shield may be added to cover the package.