Mold Compound Dispensing Layout for Balanced Semiconductor Encapsulation
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Solution Overview
Problem
During the encapsulation process of semiconductor device packages, unbalanced mold flow caused by uneven application of molding compound can lead to damage of internal components, such as bonding wires, due to incomplete fills or deformation, especially as devices become more complex and bonding wires lengthen, resulting in reduced yields and increased manufacturing costs.
Innovation Solution
A method and system for applying molding compound non-uniformly to semiconductor device packages by using a dispenser controlled by topological data, where more compound is applied to segments without die stacks than to those with die stacks, counteracting unbalanced mold flow forces during compression molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If molding compound is applied uniformly to the entire substrate, then the encapsulation process is simple and fast, but unbalanced mold flow occurs causing wire sweep and voids
Solution Approach 1:
The patent applies different amounts of molding compound to different segments of the substrate based on their topological characteristics. Segments with die stacks receive less compound while segments without die stacks receive more compound, creating a non-uniform distribution that compensates for differential compression and prevents unbalanced mold flow during encapsulation.
2Adaptability or versatility
If bonding wires are made longer to accommodate complex semiconductor devices, then device functionality is improved, but the risk of wire damage during encapsulation increases
Solution Approach 1:
The patent preemptively counteracts the forces that would cause wire damage by adjusting the molding compound distribution before compression occurs. By applying more compound to segments without die stacks, the system pre-balances the pressure distribution, preventing wire sweep and deformation during the encapsulation process.
3Manufacturing precision
If molding compound is applied to segments without die stacks, then complete encapsulation is achieved, but unbalanced mold flow causes wire sweep and voids
Solution Approach 1:
The patent changes the parameter of molding compound quantity from uniform to non-uniform distribution. By varying the amount of compound applied to different segments based on topological data, the system achieves complete encapsulation while preventing unbalanced mold flow that would cause wire sweep and voids.
Data Source
AI summary
A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.